New solder paste from Henkel
Oct 19, 2004
The electronics group from Henkel has announced the launch of a new solder paste, Multicore MP218.
A halide-free, no-clean formulation, MP218 is pin-testable and offers broad process windows for both printing and reflow. Significantly, it also exhibits very high resistance to humidity, a particular advantage for multinational manufacturers wishing to qualify a single solder paste that will perform dependably within assembly environments ranging from arid to humid around the globe.
Multicore MP218 is suitable for reflow in air or nitrogen, giving excellent solderability on a wide range of surface finishes. Post-reflow, the solder paste leaves colourless residues to ease visual inspection. Being of soft, non-stick consistency, the residues also permit reliable in-circuit testing without clogging test probes, even after being subjected to double reflow and many hundreds of tests.
Multicore MP218 is initially available in Sn62 and Sn63 alloys, and 63S4 alloy where anti-tombstoning properties are desirable. A lead-free version of the solder paste offering similar process advantages is under development and due to be released shortly.
For more information visit the Henkel Electronics website at www.henkel.com/electronics.