Soldertec Global requests applications and nominations from electronics industry for the prestigious 2004 Lead-free Solder Awards
Sep 16, 2004
Soldertec Global is offering individuals or organisations involved with the development of lead-free technology the opportunity to apply for one of this year's Lead-free Solder Awards. The awards recognise significant contributions which researchers, engineers or companies have made to the development and implementation of lead-free electronics soldering during 2004. Applications can be made directly by individuals or organisations, but industry is also encouraged to provide nominations of individuals they feel should be recognised through this award. Applications or nominations should be made by email to email@example.com describing in less than 300 words the work of the individual towards achieving the successful introduction of lead-free electronics. The deadline for application is 15th October 2004 and winners will be announced in November 2004.
Past awards have been made for leading collaborative research projects, introducing lead-free soldering into production, making particular improvements in process technology or contributing to knowledge through academic studies. Details of previous award winners can be found below.
The Soldertec award was established in 1999 to mark the launch of Tin Technology's Lead-free Soldering Centre (Soldertec Global) and was granted in its first year to Dr Kenichiro Suetsugu of Panasonic, in Japan, in recognition of the successful introduction of lead-free soldering in mass production of the portable MiniDisc SJ-MJ30-S.
2000 - Dr James Vincent, of Marconi, for his work as project leader of the European based IDEALS collaborative programme and Prof Tadatomo Suga, Tokyo University, for his leadership of the Japanese NEDO lead-free project.
2001 - Professor Suganuma, Osaka University, for his contribution to the understanding of lead-free materials through continuing research activities, and to Dr Carol Handwerker, of NIST USA, in recognition of her efforts as a key participant of the NCMS project and her involvement in the NEMI lead-free programme.
2002 - Dr Dongkai Shangguan, Director of Advanced Process Technology, Flextronics US and previously of Ford/Visteon, David Bergman, VP Standards, Technology and International Relations, the IPC, and, the Lead-free Component Focus Group, Chaired by Mark Kwoka of Intersil. These winners reflect a range of activities on lead-free soldering from industrial roadmapping and leadership, to detailed technical studies.
2003 - HDP Users Group (HDPUG) in recognition of the group's key accomplishment in resolving issues leading to supply chain readiness for the launch of lead-free products. Dr. Ning-Cheng Lee (Indium Corporation), Dr Edwin Bradley (Motorola) and Dr. Vahid Goudarzi (Motorola) who jointly developed Quickstart program. Dr. Hector Steen (Henkel Technologies - Multicore) for his contribution to fundamental research and publications arising from collaborative lead-free projects over a 15 year period.
More info is available from the Soldertec Global website www.lead-free.org