Indium Corporation to exhibit at ATExpo
Sep 03, 2004
Indium Corporation of America will be exhibiting at Assembly Technology Expo (booth # 5631) in Rosemont, IL on Sept. 28-30 focusing on Pb-Free Solders and Through-hole Assembly Options for Mixed-Technology Boards, using both leaded alloys and lead-free materials. On hand will be experts in the field of electronic assembly materials to discuss current applications and alternative solutions. A technical article on Through-hole Assembly Options for Mixed-Technology Boards is available by contacting abrown@indium.com. ATExpo is the world's largest "all assembly' trade show featuring the newest technologies, ideas and solutions to optimize assembly operations. The event attracts around 600 suppliers and over 110,000 industry professionals from 25 countries.
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