Dow Corning and INVINT team up
Sep 14, 2004
Dow Corning Corporation has signed a joint development contract with Scotland's INVINT Limited, specialists in conductive polymer interconnect technology. The agreement is expected to lead to the development of a variety of new interconnect technologies for the global electronics industry.
Under the contract, INVINT will develop and characterize novel interconnect processes based on new Dow Corning conductive polymer products, including both organic- and silicon-based materials. Conductive polymer materials are increasingly being used in a wide range of interconnect applications, from cell phones and smart cards to military and automotive electronics. The conductive polymer market is expected to see significant growth over the next few years, with demand in the United States alone increasing 5.9 percent annually to become a $4.5 billion market in 2008, according to market researcher The Freedonia Group.
"Our collaboration with INVINT exemplifies the best of Dow Corning's solutions-based thinking. When developing new products, we're also looking at the integration and process challenges customers will face when adopting a new material," said Tom Cook, global industry executive director, Dow Corning. "Working with a company of INVINT's caliber will enable us to provide smart, manufacturable processes that help customers reach their top-line business goals faster and easier than ever before."
"With development of new processing methods, conductive polymers promise to significantly improve device performance and make advanced interconnect technologies more cost effective and efficient," said Bill Matthews, managing director of INVINT "We've long seen the potential of conductive polymer interconnects and are delighted that Dow Corning is bringing its decades of experience and materials knowledge to bear on this market."