Henkel Technologies introduces Hysol GR828
Aug 19, 2004
Henkel Technologies has announced the latest addition to its family of semiconductor packaging materials.
Hysol® GR828 is a semiconductor grade molding compound specifically designed for SO packages with nickel palladium gold (Ni/Pd/Au) or copper silver (Cu/Ag) spot lead frames that require JEDEC Level 1 260° C reflow and green flame retardant technology.
This innovative material is suitable for a wide range of package types including SO, SOP, SSOP and TSSOP, thus giving semiconductor packaging professionals the versatility and flexibility they require. Other notable benefits of Hysol® GR828 are its excellent molding characteristics, high productivity and low wire sweep properties.
With a wide processing window, Hysol® GR828 is a Green (patented), non-antimony/non-bromine/non-phosphorous, flame retardant material and conforms to JEDEC Level 1 260° C reflow requirements and UL 94 V-O at 1/8-inch thickness.
For more information on Hysol® GR828, call 1-716-372-6300 or send an e-mail to firstname.lastname@example.org.