SMTA Ohio Valley Chapter to focus on lead-free solutions
Aug 24, 2004
Materials, Processing, and Reliability of Lead-free Solder Solutions will be presented by Dr. Dan Baldwin of Engent, Inc. / Georgia Institute of Technology on October 26.
This program, sponsored by the SMTA Ohio Valley Chapter, will be held at the Radisson Hotel Columbus in Worthington, OH, in conjunction with the chapter's annual vendor day.
This course will present a review of the materials, processes, and reliability of lead-free solder solutions. It will focus on materials selection based on environmental impact, legislation, and market trends. Furthermore, it will highlight lead-free solutions for component lead terminations, connectors, and PCB surface finishes.
Visit the Chapter Tutorials page of the Education & Events section on smta.org for full details and secure registration, or contact SMTA chapter & education coordinator Espi MacMillan: +1 952-920-7682 or email@example.com.