Loctite introduces new sealant for automotive electronics assembly
Aug 26, 2004
Henkel Technologies has announced the availability of Loctite 5252, a medium viscosity, UV and moisture curing sealant designed for post-assembly use on electronic module enclosures.
The new material is described as particularly well suited for high-volume automotive electronics manufacturing.
Based on a unique polyether rubber technology, the thixotropic sealant offers controlled flow, dispensing easily and fully sealing seams without seepage or dripping. The rapid UV cure characteristic of the product is said to significantly improve throughput, as it allows users to tack the material within seconds and proceed to subsequent processes.
Other beneficial features of Loctite 5252 include a secondary moisture cure mechanism that guarantees complete cure even in shadowed areas and a sealant-incorporated fluorescent dye which enables online inspection for accurate and complete application.
Because of the high bond strength of the sealant, proper sealing is guaranteed for the life of the sealed devices. This product is ideally suited for passenger compartment, underbody and some under hood modules, and will withstand temperature ranges from â€“40°C to +125°C.