Enthone Introduces ENVISION(R) HDI Direct Metallization for High Density Interconnect applications
Jul 16, 2004
Enthone, Inc., is introducing ENVISION HDI, a new single-pass direct metallization system. ENVISION HDI is specifically designed to provide complete coverage of blind vias and high-aspect ratio through-holes. Composed of process chemistry and horizontal equipment, the patented system selectively deposits a thin, highly conductive polymer on resin and glass that easily meets or exceeds current reliability standards.
The low viscosity of the ENVISION HDI three-step process chemistry enables thorough wetting of blind microvias. The selective nature of the process provides a clean copper surface for smooth-plated deposits, without requiring additional cleaning or microetch steps.
ENVISION HDI includes horizontal equipment specifically engineered for plating of microvias and high aspect ratio through-holes. Featuring specially designed fluid dynamics, the equipment ensures excellent metallization results in a single-pass even with blind vias on both sides.
"ENVISION HDI provides an environmentally sound, cost-effective alternative to electroless copper or other direct metallization systems, including palladium, carbon or graphite." said Eric Stafstrom, Enthone Global Product Manager, PCB Metallization. "It is extremely reliable in high-volume situations, while its short-cycle times makes it extremely cost-effective."
ENVISION HDI may be used on all PCB types, and is ideally suited for applications with 100 um microvias or smaller.