Amkor to acquire Unitive

Positions Amkor for leadership in high growth markets for Flip Chip and Wafer Level Packaging

Amkor Technology, Inc. (NASDAQ: AMKR) announced that it has signed definitive agreements to acquire privately-held Unitive, Inc., based in North Carolina ("Unitive"), and to obtain a majority interest of approximately 60% in Taiwan-based Unitive Semiconductor Taiwan Corporation ("UST"), a joint venture between Unitive and various Taiwanese investors. Unitive and UST are among the world's leading providers of wafer level technologies and services for flip chip and wafer level packaging applications.

With these acquisitions, Amkor gains industry-leading technology for electroplated wafer bumping and turnkey wafer level "chip scale" packaging, together with installed and operationally qualified, high volume 200mm and 300mm electroplated wafer bumping and wafer level packaging manufacturing operations. Unitive is on the forefront of development in "back-end" wafer level processing technologies including wafer level CSP, electroplated lead-free and low alpha wafer bumping, fine pitch solder bumps, redistribution, and multi-layer thin film capabilities. Unitive is currently working with more than 50 customers on nearly 200 application development projects.