ICEP 2003, April 16-18, 2003 Tokyo

IEEE and IMAPS-sponsored conferenceFormerly the IEMT/IMC Symposium, ICEP is the electronics industry’s largest international conference in Japan.Now in its third decade, this year’s event will comprise 14 technical sessions at which 93 papers will be presented. Topics covered will include 3D packaging, Interconnection, Advanced packaging, Flip-Chip, High-speed/High-frequency, LTCC, Pb-free solder, Optoelectronics, Simulation, Materials, Substrate, Plating, Thermal treatment and Design/Testing.Alogside the conference, the Microelectronics Show will provide an opportunity to see the latest in material, equipment, and commercialized technologies.More information at http://www.jiep.or.jp/jiepweb/icep/2003icep/2003icep_prg.htmlSource: PCBNewsline