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Camtek Ltd to transfer to Nasdaq Smallcap Market

by
Feb 05, 2003

UPDATES Q4 REVENUE GUIDANCE EXPECTING STRONGER Q1/'03CONTINUES IMPLEMENTING COST-CUTTING MEASURESCamtek Ltd. (NASDAQ: CAMT) reported that the Nasdaq Listing Qualifications Panel has determined that the listing of the Company's ordinary shares will be transferred from The Nasdaq National Market to The Nasdaq SmallCap Market effective the open of business on February 5, 2003. The Company's ordinary shares will continue to trade under the symbol: CAMT.Camtek's continued listing on The Nasdaq SmallCap Market is contingent upon the successful completion of an application and review process. This process will require the Company to file a transfer application to the Nasdaq SmallCap Market and to pay all initial listing fees.On another matter, Camtek further announced that it is updating its guidance for the fourth quarter of 2002. According to the new guidance, revenues for the fourth quarter are expected to total between $4.2-4.6 million. Camtek's previous guidance forecasted $5-7 million. Rafi Amit, Camtek's CEO, commented: "The lower-than-expected revenues are the result of rescheduling to the first quarter of 2003 of deliveries and installations of some existing orders. As a result, the first quarter of 2003 looks stronger at this point. We do not view this as weakening of our business or markets, which, under the limited visibility we have, still appear flat."Mr. Amit added: "We have recently implemented a reorganization program with the main purpose of further lowering our costs while shifting our focus onto areas that demonstrate higher short term potential. We have transferred sales and customer support resources from Europe and the US to Asia, to support the higher level of manufacturing activity there, and to accelerate the training process of domestic personnel. We have also consolidated our Microelectronics products division - formerly Inspectech - with our HDI products division. The new division, named Microelectronics and Packaging (MEP), is headed by Amir Gilead, our Vice President of Semiconductor Packaging (HDI) Division," concluded Mr. Amit.Source: PCBnewsline

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