Datacon’s die bonding equipment increasingly utilized by Skyworks
Jun 16, 2004
To date, Skyworks has purchased numerous Datacon 2220 apm dual-module multi-chip die bonders for the company’s assembly and test facility located in Mexicali, Mexico. Skyworks added the additional Datacon equipment to meet rapidly increasing demand for their System in Package (SiP) power amplifier (PA) modules.
“Skyworks and Datacon have developed a strong customer-supplier relationship over the past year. As a leading supplier of power amplifier and integrated RF modules for the telecommunications industry, Skyworks expects high-quality performance from Datacon’s advanced packaging solutions,” said David Halk, general manager for Datacon North America.
“Datacon’s equipment continues to provide exceptional technical capability, supporting the demanding design and process requirements of our highly integrated, leadership RF module products,” said Steve Machuga, vice president of technology development at Skyworks. “Our collaborative relationship and Datacon’s continued commitment to strong applications and field support has enabled Skyworks to successfully ramp high volume production of our latest products to ensure delivery to our key customers.”