Lead Free Fluxing for Wave Solder Systems
Jun 17, 2004
Ultrasonic Systems, Inc has developed a new solution to apply no-clean, low solids flux for lead-free wave soldering. Nozzle-free “Ultra-Spray” technology with reciprocating motion enables the proper amount of flux to be applied uniformly and repeatably with complete through-hole penetration. Higher operating temperatures of lead free alloys require flux chemistries with stable activators, excellent wetting properties and minimal post wave residue. But flux chemistry alone cannot guarantee good soldering success. Precision fluxing technology is the solution. Too little flux can cause bridging and poor wetting. Poor through-hole penetration can result in insufficient solder joints. Too much flux can cause solder balls or leave harmful residues that are not removed in modern no-clean operations. Call or visit our web site today to learn more about our “Ultra-Spray” solution for lead-free spray fluxing and upgrading your wave-soldering machine with a USI Spray Fluxer. www.ultraspray.com
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