Design guidelines for high-performance circuits
Jun 16, 2004
Teradyne, Inc. (NYSE: TER) Connection Systems Division (TCS) announced the availability of its Design Guidelines for High Performance Circuits. The document covers product design rules, manufacturing capabilities, design for manufacturing (DFM), design for assembly (DFA) and design for test (DFT) and is available upon request from the company's website at http://www.teradyne.com/dfm. The new HPC guidelines provide design criteria that will promote high levels of reliability while helping to lower costs and cycle time for printed circuit boards fabricated at Teradyne and complements the previously published Backplane Assembly DFM Guidelines. This extensive support is part of the TCS's high-performance connection systems suite of design tools and supplements the face-to-face design work performed by the company's Field Applications Engineers. "Increasing signal speeds make the circuit board a critical element in the design path to achieve higher levels of system performance. Early planning is essential in the concept phase to define the optimal design," says Bob McGrath, Teradyne HPC Applications Engineer. "Providing design guidelines up front is just one way we can help our customers produce the best design on the first pass and, as a result, save time and money building prototypes." Teradyne offers engineering assistance from early design phase through production ramp to optimize cost, performance and time to market. The company provides high-speed signal simulation and characterization, impedance modeling, system design and HPC layout assistance. Teradyne's printed circuit technology and fabrication capabilities include: a wide variety of materials to enable increasing signal speeds, deep microvias, buried, blind and backdrilled vias, sequential lamination, panel sizes from 16" x 18" up to 24" x 54", layer counts 6 to 60+ and board thicknesses up to .440". Teradyne's printed circuit fabrication facility is MIL-PRF-31032/1A, /2, MIL-P-55110 and ITAR certified. To request a copy of Teradyne's Design Guidelines for High Performance Circuits, visit http://www.teradyne.com/dfm.
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