Dominique Numakura's Newsletter from Japan
Jun 04, 2004
March PWB production in Japan METI of Japanese government released the monthly production data of PWB industry in Japan. The total March shipment increased 12.4% to 67.7 billion yen compared to previous month. All product categories had remarkable growths. But it was not a surprise. It is a normal phenomenon of March because of the final month of the fiscal year. Japanese manufacturers purchase extra materials and components for the adjustment of the budgets. It made a 12% growth if we compare the number of the total revenue with the same month of the last year. The multi-layer boards (29% grow), especially 4-layer board (35% grow) made the major contribution of the total growth of the month. The growth of the single sided rigid boards is only 6%. But it better than zero. Double sided rigid boards made a relatively large growth of 23.2%. Flexible circuits made a relatively mild growth (7.8%) this month. One of the manufacturers said that they had more demands and capacity, but they did not have enough materials. There is a strange number in the data. It was 36% decline of the rigid module, actually the substrates for the IC package from the same month of the last year. It had relatively large revenue in March of 2003. But the decline of this month was more than that. We should pay attention for the data of the next month. Dominique Numakura Headline News Tamura Seisakusho (Material supplier for the electronics packaging) 5/24
Developed a new lead-free soldering system with 80 micron pitch micro bump arrays. CMK (The largest PWB manufacturer in Japan) 5/24
Will increase the manufacturing capacity of build up multi-layer board in Wuxi, China to 10,000 square meters per month from 7000 square meters. Muromachi Chemical (Electronics material supplier in Japan) 5/24
Developed a new electroless copper plating process without etching and platinum. Asahi Glass (Major glass manufacturer) 5/25
Will found a glass substrate manufacturing company in Korea for the booming demands of LCD market. Nikkan Industrial (Major flexible laminate manufacturer in Japan) 5/26
Will start the license production of adhesiveless flexible laminate of Du Pont’s Pyralux AX in the new line of Takahagi Plant. Nihon Auto Giken (Middle class PWB manufacturer in Japan) 5/25
Will increase the production of shielding layer for the Bit2 process to cover the booming demands of the camera cellular phones and digital cameras. Nippon Steel Chemical (Major flexible circuit material manufacturer) 5/26
Had developed a new adhesiveless flexible laminate with ED copper foil, which has smooth surface. The new laminate has good peel strength with transparent base film. Nippon Avionics (Equipment manufacturer) 5/26
Commercialized a new high density PWB repair machine “ELP-1000A”, which is capable for 20 micron line and space. Nippon Avionics (Equipment manufacturer) 5/26
Commercialized a new RTR AOI machine “ATES-3200” for high density flex circuit and TAB. The AOI machine is capable for 20 micron pitch trace (10 micron line/space). YAMAHA (SMT equipment manufacturer) 5/27
Developed a new middle class mounting machine “YG100”, which has 20% higher speed compared the other models. The shipping will be started in October. Fuji Film (Major photo film supplier) 5/29
Will expand the manufacturing equipment business from semiconductors to printed wiring boards. The first product is laser direct imaging machine for the fine traces. All original news items were written in Japanese. Volunteers are choosing the topics and translating to English for free delivery. We are not responsible for the accuracy of the news. Quick news is the first priority of the headlines, therefore, we can not eliminate all of the mistakes in the translations.
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