Lead Free Technology For Electronic Assemblies
Jun 08, 2004
Problems and Promises - Two Day In-Depth Course
By Dr. Raiyo Aspandiar, Intel Corp
Ray Prasad, Ray Prasad Consultancy Group Dates: July 26-27 8:30 AM to 5:30 PM (Monday and Tuesday)
Location: BeamWorks, Inc., 15375 SW Beaverton Creek Court, Beaverton, Oregon 97006 Course Fee: $695 The course fee includes all course materials, lunches and refreshments. Each attendee will receive a comprehensive workbook containing all the presentation materials including a comprehensive list of references of published materials and free downloads. How to Register
For detailed course description, log on to http://www.rayprasad.com/course_link.html. Please send your registration with your contact information along with your check to Ray Prasad Consultancy Group; 15375 SW Beaverton Creek Court, Beaverton, Oregon, 97006, Tel: 503-646-3224, FAX 503-646-1654, Email: smtsolver@aol.com About This Course
This course brings you the same instructors who were on the ground floor of SMT implementation at Intel in the mid 80s. They have graduate degrees from Berkeley and Stanford in Metallurgy and Materials Science and are well versed in metallurgy of lead free. They have years of hands on experience in implementing SMT and lead free in small and large companies to help you identify both business and technical issues in lead-free conversion. This is not a theoretical course. We will use actual Intel case studies to show you the pitfalls and successes of Lead-free Implementation. We will also show you how you can resolve the business and technical issues (principles as well as practice) for an effective implementation of lead-free at lower cost and higher yield. Most lead-free solders have higher melting points than currently used tin-lead solders and thus pose a challenge for all board assembly processes, including rework. Lead free will impact almost everyone in the electronics industry from suppliers of components, boards and materials like paste and flux, to manufacturers and users of electronics products and equipment. You need to get on board or risk losing market share because this lead free train is moving fast due to impending legislation and market forces. In addition to discussing the details of in-house lead free implementation, we will also show you the questions that you should ask your Contract Manufacturer (CM) if you plan to outsource/off-shore your product. We will provide you all the technical details including wave and reflow profile development, paste selection, inspection and rework using both conventional and diode laser of lead free solder joints that will not be as bright and shiny as you are used to. We will also provide you the status of legislation banning lead around the world including Europe, Japan, China and USA and how you can improve your companys profile and benefit from this disruptive technology. The major outline of the course is given below:
Background
Legislation For Banning Of Lead Around The World
Market Forces Driving Lead Free Conversion
Real Cost Of LF Implementation
Standardization And Consortia Efforts For Lead Free
Metallurgy Of Lead Free Solders
Component And Board Surface Finishes
Reliability Of LF Solder Joints
LF Implementation In Manufacturing
LF Outsourcing Manufacturing / Supply Chain Management
LF Rework Using Soldering Iron, Hot Air And Diode Laser
Details Of A Intel Case Study For LF Implementation
Manufacturing Conversion Strategy To Lead Free Products
References And Free Downloads Target Audience for this Course: Engineers and Managers who are either already into lead free or thinking of getting into lead free will benefit from this course. You will get an insight into the essential details of lead-free soldering technology that you can use to successfully implement lead free in your process and products, and leverage your considerable investments to succeed in the marketplace. This information will enable you to achieve higher yield, lower cost and faster time to market with lead free products.
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