Motorola trials IPC standard on shopfloor
by
Feb 03, 2003
Communications standard lowers operating costsMotorola has announced the successful completion of an initial trial of the IPC 2501 factory floor messaging standard in its automotive communications and electronics systems factory in Texas. The new IPC 2501 standard is designed to significantly lower the cost of ownership of factory information systems by leveraging existing Internet infrastructure investments and providing enhanced communication of data from shop-floor equipment through the manufacturing enterprise into the supply chain. The purpose of the trial run was to test the robustness of the IPC 2501 standard in a live factory environment and to verify its compatibility with existing Intranet/Internet infrastructure. Several key members of the IPC standards committee were involved, including Agilent Technologies, Georgia Institute of Technology Manufacturing Research Center, FUJI America Corporation, Motorola, Siemens -Dematic Electronics Assembly Systems AG (Siplace), and Teradyne, Inc. To run the trial, the team used the Manufacturing Pulse(TM) monitoring and execution software developed by the Motorola Global Software Group, a Siplace line optimization application and Teradyne Manufacturing Software Group's SCE collaborative manufacturing execution system. These web-based applications were used to monitor several sets of manufacturing equipment, including XML-ready Agilent 3070 in-circuit testers, Fuji CP-7 and Universal GSM pick-and-place machines. The team members gathered performance and functional feedback data on the performance, reliability and scalability of the standard over a three-day period. All the applications and equipment involved in the trial exchanged messages through an IPC-2501 compliant message broker produced by the Georgia Institute of Technology. All of the participants in the initial deployment trial agreed that this new standard offers a great deal of promise to reduce costs, increase flexibility, and provide more functionality to manufacturers.Source: PCBnewsline
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