Indium Corporation offers ultra-thin solder preforms
May 20, 2004
Indium Corporation has announced it now offers AuSn and AuGe specialty solder preforms in thicknesses <0.001 inch. Gold-alloy solder preforms address several unique soldering needs: Pb-Free: these alloys contain no lead, high joint strength: gold-bearing specialty solders deliver tensile strengths up to 40,000 psi (compared to SnPb <8,000psi), step-soldering: gold-based alloys have relatively high melting points, making them suitable materials in a step-soldering scheme, and precise volume control: Indium’s precise manufacturing process yields tight-tolerance solder preforms in all three dimensions. Gold-alloy solder preforms can be produced to thicknesses <0.001 inch. According to Indium’s Director of Fabricated Solder Products, Ross Berntson, “The physical properties of gold-alloy solder preforms enable manufacturers to go beyond their usual capabilities. Indium’s materials and applications expertise are a part of several manufacturing success stories. Indium’s ultra-thin technology provides for even greater solder volume control.” For more information visit: www.indium.com
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