DDi Corp. Licenses ThermalWorks' STABLCOR(R) Technology
May 21, 2004
DDi Corp. (Nasdaq: DDIC) announced that DDi is now a licensee of ThermalWorks' STABLCOR® Technology, an advanced thermal management solution for printed circuit board fabrication.
"DDi is dedicated to technology development and supplier partnerships that enable us to better provide for our customers," commented Bruce McMaster, Chief Executive Officer of DDi. "STABLCOR technology features thermal management properties that are unique among PCB materials, and we are excited about working with this technology to develop solutions for our customers."
STABLCOR technology pulls heat away from the components through the PCB. The technology has the ability to match the CTE (Coefficient of Thermal Expansion) of PCBs and substrates to large scaled BGAs (Ball Grid Arrays) and WLP (Wafer Level Packages). The higher stiffness and rigidity of STABLCOR allows higher yields in assembly manufacturing and reduction of mechanical reinforcements. This total PCB and substrate solution increases the overall reliability of the end product.
"ThermalWorks is very pleased to have a quality printed circuit board manufacturer with such strong engineering and manufacturing capabilities and industry reputation as DDi become a licensee of STABLCOR® Technology," said Don Roy, Vice President Sales & Marketing, ThermalWorks, Inc.