Oven for soldering/curing/testing
Apr 19, 2004
The RO06plus from ESSEMTEC offers a new possibility to run testcycles with a duration of up to 18 hours. This function is mainly used in the area of component or material testing, for special curing applications or for burn-in in temperature ranges up to 300° C
Beside these new functions offers the RO06plus the possiblity to solder PCB's with standard or lead free pastes. The integrated full convection chamber ensures lowest Delta-T values and narrow process windows. The compact design allows to use the oven even in narrow locations like development or testing laboratories.
The motorized drawer moves the parts/PCB's automatically into the heating chamber as soon as the programmed base temperature is reached. After finishing the temperature cylces the automatic drawer systems moves the pieces out into an integrated cooling zone.
An additional N2 connection with integrated flow meter allows to operate the oven with an inert atmosphere.
A software recored temperature profiles of the parts/PCB's as well as the oven temperature itself in real time. Protocols from the software can be saved, printed and compared with original profiles.