Lead-free roadmap agreed

International framework recommends actions and timescales for introduction of new materials and processesFollowing the 2nd Lead-free Summit meeting held in Tokyo in November, Europe’s SOLDERTEC and JEITA (Japan Electronics and Information Technology Industries Association) have launched their International Lead-free Soldering Roadmap Framework, a document that gives electronics manufacturers guidance about the timely implementation of lead-free production processes. The framework recommends timescales for electronic components manufacturers and electronic assemblers to initiate, and complete, the transition to lead-free, suggesting, for example, that component manufacturers have a complete line-up of lead-free components by the end of 2004. The document also recommends the use of 0.1wt% as a maximum concentration for Pb in 'lead-free' products. The publication of the framework follows the recent agreement on the EU WEEE (Waste Electrical and Electronic Equipment) and RHS (Restriction of Hazardous Substances in Waste Electrical and Electronic Equipment) Directives. The RHS ban on hazardous materials has been confirmed as July 1, 2006 making lead-free a requirement for any products on sale to European consumers after this date. A phase-out of cadmium, mercury, hexavalent chromium and two types of brominated flame retardants (PBB and PBDE) will also be required. The final voting and approval procedures for WEEE and RHS were successfully completed by both the European Parliament and Council during December 2002 removing any remaining doubt over the certainty of introduction of both pieces of legislation. The document lays out the following schedule for manufacturers, adding that leading manufacturers will achieve these results one year ahead of this schedule, other manufacturers two years later: Components: Commenced supplies of lead-free components/lead-free terminal components: by the end of 2001- Complete line-up of lead-free terminal components: by the end of 2003- Complete line-up of lead-free components: by the end of 2004Assemblies: Commence manufacturing of lead-free soldering assemblies: by the end of 2002- Complete lead elimination from products: by the end of 2005 It recommends a solder alloy composed of Sn-Ag-Cu for board assembly; it emphasises that lead-free solder technology has been shown to be compatible with existing PWBs, and it says that identification of material contents is needed for rework and/or recycling, and that further work is required to develop a recommended system for labelling.Source: PCBNewsline