EIPC Summer Conference Basel 2004 and Table Top Exhibition
Apr 28, 2004
How to improve yields and reduce manufacturing costs in PCB fabrication by mastering the tolerances required by new PCB designs Hole-formation, imaging, plating and etching are the most expensive processes in PCB fabrication. How can these be infuenced to maintain high quality and maximise output? Location: Hotel Europe
Date: June 24 & 25, 2004
Place: Basel, Switzerland The European Institute of Printed Circuits (ElPC) extends an invitation to all those companies and individuals who are active in the Packaging and Interconnection Industry to participate in the ElPC Summer Conference to be held on June 24 & 25, 2004 in Basel, Switzerland. The purpose of the EIPC Summer Conference Basel is to provide a platform for speakers and delegates to exchange information on the current market conditions, future innovation on interconnection and packaging as well as assembly of electronic and optoelectronic circuits. Delegates from throughout Europe will attend this event, offering presenters the opportunity to reach a targeted audience of decision makers and leaders of the international packaging and interconnection industry. This conference is an absolute ‘must’ for companies associated with PCB fabrication who wish to stay up to date with the latest market requirements, materials, fabrication equipment and manufacturing processes who also need to improve the ef?ciency of their processes and the reliability of their products. WHO SHOULD ATTEND?
Engineers and decision-makers in the ?eld of OEMs, EMS, assembly, and PCB fabricators as well as board and system designers at all levels are invited to participate. Circuit board designers, looking into more cost-effective solutions and miniaturisation, will learn about the developing trends in different applications. Board fabricators and development engineers will gain background information that will help to focus on more pro?table products. Specialists and marketing managers will gain additional background data to focus on advanced PCB applications. OEMs will get a better understanding on how to get prepared for the next generation of electronic products. WHY BASEL?
Evidence of Roman, Alemannic and Frankish trade and military settlements all suggest that Basel area has been a place of permanent settlement since the ?rst and second centuries BC. The name itself derives from Basilia, the Romans name for their camp. However, for EIPC this is but a temporary home, but is ideally located in the ’Dreiländereck’, the triangle formed by the three countries of Switzerland, Germany and France. The historical and unspoilt city on the bend of the Rhine offers a big variety of sights and places of interest, including museums, modern architecture, historical churches and art in public places. Basel has three rail stations and is an important European motorway junction. The international airport, the EuroAirport Basel-Mulhouse Freiburg, is 10 minutes away from the city ARRANGE A SALES OR BUSINESS MEETING
If you are thinking of arranging a sales meeting or a business meeting for your company during 2004, why not plan to hold it at the Hotel before or after the ElPC Summer Conference Basel? You could certainly bene?t from having your industry colleagues available to participate in the event. Call Kirsten Smit-Westenberg at the ElPC of?ce to reserve a meeting room. CONFERENCE DINNER IN BASEL
The Get Together and Networking Dinner on Thursday evening, June 24, 2004, is open to conference delegates and their guests. Why not participate and make this an unforgettable event for you and your customers? For delegates this dinner is included in the conference fee. If you would like to order additional tickets for your guests, you can indicate this on the conference registration form or you can order extra tickets by sending an e-mail to kwestenberg@eipc.org POST CONFERENCE TOUR
On Saturday June 26th a Post Conference Tour will be organized. This year’s activity will be a Guided Sightseeing Tour through Basel, followed by a Lunch-Tour on a boat on the river Rhine. The Guided Sightseeing Tour will start at the hotel and will take you to some of Basel’s ?nest places of interest. The tour wil end at the boat which will sail out for a Lunch-Tour on the beautiful river Rhine. The Post Conference Tour will start in the morning and will end in the afternoon. If you would like to participate, please indicate this on your conference registration form or send an e-mail to kwestenberg@eipc.org. Costs EIPC Members: EURO 80.00 per person
Non-Members: EURO 100.00 per person
Programme Day One
The goal of this Conference is to define how the most expensive processes in PCB fabrication can be impacted to maximize yield and profit. 11.30 LUNCH and networking Hotel Europe Restaurant 13:00 Welcome by the EIPC Chairman Paul Waldner Session: Technology Developments and Trends in PCBs
Moderator: Paul Waldner, mie, Germany 13:15 Innovation of products and processes with science and technology
Prof. Günther Leising, AT&S AG, Austria 13:45 Improved yield and resource utilization with large panels and LDI imaging
Steve Jones, Material Solutions Ltd., UK 14:15 Advanced X-Ray inspection technology as a tool to improve yields and reduce manufacturing costs in PCB Assembly
Holger Behnsen, Feinfocus Röntgen-Systeme GmbH, Germany 14:45 Coffee Break Session: Registration
Moderator: Martin Goosey, Rohm and Haas, UK 15.00 Mastering the tolerances required by New PCB Designs
Brad Hammack, Multek, China 15:30 Accuracy in?uences of layer positions by producing multilayer PCB.
Hans Preu, Moderne Elemat, Germany 16:00 Registration problem? What registration problem?
Frédéric Baradel, Automa-tech Advanced Technologies, France Session; Plating
Moderator: Giovanni Tridenti, Somacis, Italy 16:30 Electroless Silvermix, a unique autocatalytic chemical silver plating process
Ulf Palmberg, Polymer Kompositer AB, Sweden 17:00 Avoiding hole wall pull away in high Tg Laminate materials
Tom Thieme, Atotech Germany 17:30 High reliability and productivity Metallization process for blind microvia
application. Dr. Jürgen Hupe, Enthone GmbH, Germany 18:00 End of the day one 19:15 Departure for Evening Dinner
Programme Day Two
08:30 Welcome by the session moderator Arie Reichart, Eltek Ltd. Session: Challenges in the PCB Markets
Moderator: Arie Reichart, Eltek Ltd. 08:45 Sustainable growths in a recovery market! How to manage this challenge with limited resources from recession?
Hans J. Friedrichkeit, PCB-Network, Germany 09:15 How to manage successfully the challenges from China
Stephan Herr, Simon Kucher & Partners, Germany 09:45 An overview of digital printing for advanced interconnect applications
Tom Sutter, Rohm and Haas, USA 10:15 Coffee break Session: Technology innovation
Moderator: Jules Limpens Cimnet Informationssysteme GmbH 10:30 Challenge the Laser! Cost effective mechanical small hole drilling
Thomas Kunz, Schmoll-Maschinen, Germany 11:00 New applications of UV Laser Drilling
Paul Marsden, ESI/MIE, Germany 11:30 Laser Direct Ablation of solder mask: a high density enabling technology
Stefan Lesjak, SIEMENS Dematic, Germany 12:00 “The future of resist technology -New requirements and new ?elds of
application-” Dr. Manfred Suppa, Lackwerke Peters, Germany 12:30 AOI Innovations developed to cut the manufacturing costs
Alfred Kaiserman, Orbotech, Belgium 13:00 Lunch Session: Innovation: Market changes & OEM needs and developments
Moderator: Dr. N. Münzel Huntsman Advanced Materials 14:00 The technology and Market developments in Asia
Dr. N. Münzel, Huntsman Advanced Materials on behalf of Dr. H. Nakahara 14:30 Embedded mezzanine capacitors using Probelec CFP
Dr. Siefried Pongratz, Motorola GmbH, Germany 15.00 Thin-Film rechargeable batteries
Thomas Gottwald, Schweizer Elektronic AG, Germany 15:30 Special topic Speaker will be announced shortly 16:00 Coffee Break end of day two
for more information see www.eipc.org
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