Ormecon International introduces two new products in 2004

Ormecon International is a world-wide operating group of companies with in-depth competence in the area of Immersion Tin as solderable surface finish for printed circuit boards. In 2004, Ormecon International will introduce two new Immersion Tin products to the international market: ORMECON CSN FF and ORMECON CSN FF-W. The process development of the two new products is based on the know-how of the Ormecon International group members products (ORMECON CSN, UNICRON and OMIKRON (PLUS)) and the know-how of the technology partners.ORMECON CSN FF is designed to be a process with a pretreatment based on the Organic Metal (polyaniline) as stabilizer and catalyst for the following improved tin bath, which as a complete process will have superior features as a high volume applicable surface finish for all kinds of PCB´s. ORMECON CSN FF-W is designed to be a whisker-reduced process, with basically the same set-up as CSN FF, but additionally including a whisker-reducing ingredient. This process will meet the requirements of the PCB applications, with highest reliability and superior performance. With the introduction of these two new products to the world-wide market in 2004, Ormecon International offers key alternative surface finishes against HASL, ENIG and OSP.To provide an efficient and reliable package for its customers, Ormecon International is cooperating closely with certain equipment manufacturers for co-designing Immersion Tin machinery and processes.The Ormecon International group consists of Ormecon GmbH (group head office), Electronic Chemicals Unicron GmbH, both in Germany, and Ormecon CirTech LLC in the USA.Source: PCBnewsline