Soldertec Global announces winners of Lead-Free Solder Awards 2003

Soldertec Global has announced that three lead-free solder award winners have been selected in 2003 from the nominations received from industry. As the July 2006 lead-free compliance deadline draws near this year’s award selections have been designed to reflect the need for clear dissemination of information between the component and materials suppliers and the electronics assembly industry. This year there is a Consortium Award, a Co-operation Award and a Service Award. The winners are HDP Users Group (HDPUG) Brian Smith (Celestica), Vivek Gupta (Intel), Thilo Sack (Celestica) and others. Dr. Ning-Cheng Lee (Indium Corporation), Dr Edwin Bradley (Motorola) and Dr. Vahid Goudarzi (Motorola). Dr. Hector Steen (Henkel Technologies - Multicore)The HDP Users Group has been selected to receive a Lead-free Solder Consortium Award in recognition of the group’s key accomplishment in resolving issues leading to supply chain readiness for the launch of lead-free products. In particular we acknowledge the work of Brian Smith for the "General Purpose Lead-free Assembly System " concept, Thilo Sack for his minimum peak temperature work, and Vivek Gupta for his work on component labeling. More info is available from the Soldertec global website www.lead-free.org Source: PCBnewsline