IPC honors best papers at co-located exhibition and conference

IPC has recognized the winners of this year’s Best U.S. and International papers at its co-located IPC SMEMA Council’s APEX/IPC Printed Circuits Expo/IPC Designers Summit exhibition and conference, held February 24-26, 2004, in Anaheim, Calif. "Tin Whisker Growth—Substrate Effect Understanding CTE Mismatch and IMC Formation" received the Best U.S. Paper Award. Cookson Electronics’ Dr. Yun Zhang, Chonglun Fan, Dr. Chen Xu, Oscar Khaselev and Dr. Joseph Abys co-authored the winning paper.In addition, IPC recognized the following two U.S. papers as Honorable Mentions: "Mechanical Bending Technique for Determining CSP Design and Assembly Weaknesses" by Mark R. Larsen and Dr. Ian R. Harvey from the University of Utah, David Turner of Inovar, Inc., Brent Porter of Bourns Electronics, and James Ortowski from EDO Ceramics; and "Design of Experiment in Micro-Via Thermal Fatigue Test" by Dr. Tse Eric Wong, Harold S. Fenger and Dr. Isaac C. Chen, all of Raytheon Electronic Systems.The Martin L. Barton Best International Paper Award, named for former APEX Technical Conference Director Martin Barton, was awarded to "Phosphorus in Electroless Nickel Layers—Curse or Blessing." The paper was authored by Atotech Deutschland GmbH’s Sven Lamprecht and Hans Jurgen Schreier, as well as Kuldip Johal and Hugh Roberts, both of Atotech USA.IPC recognized "The Effect of Thermal Loaded Bend Test on the Solder Joint Reliability" co-authored by Yuanze University Taiwan’s Dr. Yeongshu Chen, C.S. Wang and C.H. Chen, as well as Solectron Corporation’s Dr. Aichyun Shiah, with an Honorable Mention for this international paper.Each winning paper received a $1,000 honorarium and a commemorative plaque from IPC. Copies of the winning papers are included in the 2004 Technical Conference Proceedings. They will also be published in the IPC’s Review, a monthly publication distributed exclusively to IPC members.Source: PCBnewsline