Polyclad Introduces 370HR Lead-free Assembly Compatible, CAF Resistant Laminate and Prepreg Systems
Feb 19, 2004
Polyclad Laminates, Inc., a Cookson Electronics Company, will introduce Polyclad® 370HR CAF resistant, lead-free assembly compatible laminate and prepreg systems at the IPC Printed Circuits Expo / APEX 2004 exhibition, February 24 - 26, 2004 in Anaheim, California, Booth 1965. Ideal for high-density designs requiring multiple soldering steps, 370HR materials contain a unique resin technology that has been production-proven to offer more cycles to failure than any other FR-4 material on the market today. Currently used in the manufacture of computer servers, telecommunications devices and other electronics, Polyclad 370HR systems offer exceptional IST thermal performance and reliability. Possessing 180 C glass transition temperatures (Tg), 370HR materials provide low expansion rates in comparison to traditional FR-4 while retaining FR-4 processability. UL listed as PCL-FR-370HR laminate and PCL-FRP-370HR prepreg, Polyclad 370HR materials are compatible with all commonly used FR-4 fabrication process techniques. 370HR's mechanical, chemical and moisture resistance easily meet or exceed the performance of competitive FR-4 materials. The system is laser fluorescing and UV blocking for maximum compatibility with automated optical inspection systems (AOI), optical positioning systems and photoimageable solder mask imaging. Polyclad Laminates, Inc. is a business of Cookson Electronics and is one of the world's leading manufacturers of laminates, prepregs and resin coated copper foils used in printed wiring boards.