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HMS's ComPlate attracts great interest

Feb 23, 2004

At the end of last year HMS-Höllmüller introduced its latest development, the electroplating module ComPlate (compact and plater). The unit has attracted much attention and raised the level of interest among customers because of its design features for new technologies such as via filling, along with a very low maintenance plating concept. The first production line is being shipped to Unimicron, the largest Taiwanese PCB manufacturer.The ComPlater is distinguished by its very low maintenance costs due to its compact design and the maintenance-free stripping system. Equipped for either pulse or direct current, the production line is ideally designed for processing acid copper or electrolytic tin. The transport system allows flexible material down to 25µm with 9µm copper cladding to be transported flawlessly. With Desmearing and PTH added before the ComPlater, customers have can have a complete processing system. Through the collective experience of 20 years and 6 platers of the former series, a system has now been introduced which expands the horizon of copper plating. The heart of the system is the HDF Tsunami push-pull circulation technology. It offers almost zero defects, and guarantees high reliability and leading edge technology.Over the next few weeks, HMS engineers will be presenting the trendsetting HMS system to customers throughout the world.Source: PCBnewsline

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