Tamura F.A. System Corporation introduces FLIP

Tamura F.A. System Corporation, a global company that develops and supplies the materials, components and products demanded by world electronics markets, has announced the availability of a new lead-free system featuring solder bath technology designed for the electronics assembly industry. FLIP Solder Bath for Lead-free Wave Soldering Solutions features Linear Induction Pumping Technology in which three phases of AC currents flow through induction coils to induce horizontal magnetic fields inside solder bath. The magnetic fields generate vertical force, which moves molten solder upward through nozzles and flow down by gravity. Two Induction coils generate magnetic field and propelling force as the alternating AC current flows in induction coils.Additionally, the FLIP Solder Bath features numerous advantages over other solder bath systems, including less solder used: only 300 kg, instead of 450 kg and less solder dross: 7 kg, instead of 15 kg, after 8 hours of operation. Also, it offers significant ease of maintenance — Open space to access inside side bath and easier nozzle cleaning and maintenance. It also features a quieter and more stable solder wave than impeller motor types. Acid oxidization around the motor spindle is said to be eliminated. Source: PCBnewsline