Universal Instruments and CyberOptics sign partnership agreement

Universal Instruments Corporation and CyberOptics Corporation have signed an agreement to integrate the new Embedded Process Verification (EPV™) inspection technology from CyberOptics into Universal’s latest-generation electronic component placement systems. Universal will offer the CyberOptics EPV sensor system as a feature on its recently released Genesis and AdVantis platform placement machines that incorporate its new Lightning placement head. Introduction of the EPV sensor is currently planned for the second half of 2004."EPV is one of the most exciting innovations in this industry in recent times," stated Ian McEvoy, president of Universal Instruments Corporation. "To achieve the challenging quality goal of less than 10 defects per million for SMT circuit board assembly, you have to verify each component placement. The CyberOptics' EPV is the first sensing system to enable this within the placement machine." Universal demonstrated an EPV prototype at the Productronica Trade Show in Munich, Germany in November 2003. Both companies plan to demonstrate the product at IPC’s annual APEX Trade Show in Anaheim, CA this month. Steven Case, CyberOptics’ Chairman and Founder stated, "Ultimately, defects detected by the EPV sensor may be corrected while the circuit board is still within the placement machine, helping to deliver the highest first-pass yields on an SMT production line."EPV technology is the latest family of sensing products being offered by CyberOptics Corporation. CyberOptics plans to discuss the new EPV technology further when it releases its fourth quarter and full-year 2003 financial results during the third week of February.Source: PCBnewsline