JPSA Laser to exhibit laser beam shaper technology

JPSA has announced it will be showcasing its new UV excimer laser beam shaper technology and short-wavelength applications development at Photonics West in San Jose, California. JPSA Laser is unique in that it develops and deploys advanced excimer and UV-DPSS laser micro-machining solutions at 157nm to 355nm wavelengths. Very few (if any) companies are said to be working with the very short 157nm and 193nm wavelengths. Shorter wavelengths mean more process control, cleaner, finer cuts in all materials, and expanded micro-machining, scribing, dicing, and complex shaping capabilities. On show also will be GaAs Wafer Dicing: The JPSA ChromaDice laser process is an inexpensive, fast, accurate, clean and non-contact way to dice GaAs chips with incredible precision, thin wafers with cuts down to 5 microns with no edge chipping. High-frequency electronics using GaAs chips require accurate mechanical placement of chips to minimize air bridges and impedance mismatches. Straight, accurate chips allow more precision in die placement and better overall packaging and electrical performance of the die. Source: PCBnewsline