Free Forums at APEX 2004
Jan 02, 2004
Join your peers and distinguished experts as they discuss the latest topics affecting the electronics industry.Often the information is so new, the technical paper has yet to be drafted. Hear candid and thought-provoking opinions on upcoming technology and market trends. Sessions will focus on electronics industry issues, as well as specific topics to help the PCB designer, manufacturer, or electronics assembler.These sessions are FREE to all registered attendees.Beyond Lead Free - WEEE/ROHS 2/24/2004 9:30 AM - 10:45 AM Fern Abrams, IPCWhile everyone has been focused on building lead-free circuit boards and solder connections, little attention has been paid to the other requirements under the European Unionís Waste Electrical and Electronic Equipment (WEEE) and Restriction on Hazardous Substances (RoHS). Our panel discussion will provide you with insights into what leading companies are doing to prepare for the July 2006 compliance deadlines along with the latest developments in legislation, exemptions, and definitions of lead-free under WEEE and RoHS. Additionally, our panel will examine the ripple effects of this legislation on laws and regulations in the U.S. and elsewhere. Panelists include: * Heather Bowman, Electronic Industries Alliance * Mark Newton, Dell Computer Corp. * Kay Nimmo, ITRI * Eric Austerman, Jabil CircuitsDomestic PCB Technology Innovations at the Naval Surface Warfare Center - Crane 2/26/2004 8:00 AM - 11:00 AM Bill Payne, NAVSEA CraneThe Emerging Critical Interconnect Technology (ECIT) Program was created to coopt Military, Academic and Industrial extension for the purpose of facilitating North American Research and Development consistent with the IPC's technology roadmap. This presentation will provide insight into ongoing ECIT projects, their goals, status, the participants, and potential delivery schedules. * Ron Thompson, Crane * Michael Fitts, Mentor Graphics * Kim Fjeldsted, Ph.D.,ESI * Dennis Fritz, MacDermid * Rocky Hilburn, Gould * David Bergman, IPC * Roger Smith, Crane * Azad Siahmakoun, Rose-ulman * David Fries, U of S FL * Jim OíKeefe, Demodulation IncIPC PCQR2 Database -- Globally Accepted de facto Standard for Comparing Process Capability, Quality and Relative Reliability of PCB Suppliers 2/24/2004 1:30 PM - 3:00 PM David Wolf, CAT, Inc.Participation in the IPC Process Capability, Quality and Relative Reliability (PCQR2) Benchmark Database has gained broad industry acceptance. Initiated in 2001, more than ten active Subscribers and over sixty global PCB Suppliers currently participate in the database. The IPC D-36 Subcommittee has developed an industry standard, IPC-9151A, for process capability test panel designs and a database detailing the capabilities of printed circuit board suppliers. The PCQR2 Database provides quantitative data that allows you to: Statistically benchmark board suppliers' capabilities * Perform intelligent sourcing * Select new suppliers * Ensure design for manufacturability * Establish realistic design rules This extensive supply chain management resource - developed for OEM and EMS companies as well as PCB suppliers - is based on industry developed patterns, proven test methods, and statistical analysis techniques. The seminar will include in-depth discussions of the test panel designs, analysis report information, and insight into the capabilities of the PCB supply chain documented in the database.NEMI DPMO (Defective Parts per Million Opportunities) Project Forum 2/25/2004 10:00 AM - 11:00 AM Tim Kruse, Plexus NPI PlusThe NEMI DPMO Project Team is nearing completion of an investigation into package-level DPMO rates throughout the electronics assembly industry. Such DPMO data can be used to quantify the expected fault spectrum on a particular PCBA, enabling manufacturers to more accurately assess the cost of assembly, test, repair and scrap and also estimate the shipped product quality level of a product. In this free forum, participants in the NEMI DPMO Project Team will present findings from the study, share the lessons learned, and discuss the vision for follow-on DPMO efforts in the industry.NEMI DPMO (Defective Parts per Million Opportunities) Project Forum 2/25/2004 10:00 AM - 11:00 AM David Mendez, Solectron Texas LPThe NEMI DPMO Project Team is nearing completion of an investigation into package-level DPMO rates throughout the electronics assembly industry. Such DPMO data can be used to quantify the expected fault spectrum on a particular PCBA, enabling manufacturers to more accurately assess the cost of assembly, test, repair and scrap and also estimate the shipped product quality level of a product. In this free forum, participants in the NEMI DPMO Project Team will present findings from the study, share the lessons learned, and discuss the vision for follow-on DPMO efforts in the industry.North America or Asia: Where is the Best Place for Your Manufacturing? 2/25/2004 1:30 PM - 3:00 PM Lisa Hamburg, Circuits Assembly.The answer to this question is not nearly as obvious as it would seem. The relative complexity, quantity required, circuit density, level of customization needed and delivery time frame are just a few of the issues that help determine the supply source. Plan to attend this panel discussion along with a Thursday technical session where the pros and cons of overseas sources will be discussed and debated.* Bill Coker, Elcoteq Americas * Mark Schwartz, Strategy & Corporate Affairs * David Wolff, P.D. circuits, Inc. * Greg Papandrew, Bare Board GroupReactivation of IPCís OEM Council 2/25/2004 1:30 PM - 3:30 PM Daryl Sato, IntelIPCís OEM council has made significant contributions to efficiency in the supply chain through development and release of standardized vendor surveys IPC-1710 (PCB), IPC-1720 (EMS) and IPC-1730 (Laminate). After a period of inactivity IPC is ready to reactivate the council. Several OEMs have been participating in a program to encourage use of IPCís PCQRR program for the PCB manufacturing chain. This activity is intended to align OE(D)M PCB technology requirements and Industry PCB Supplier capability to ensure successful current and future product launch. This group has developed a Process/System for Industry PCB Technology Assessment/Advancement that supports OE(D)M Current/Future Products. The program evaluates PCB Supplier Mfg capability, identify Technology Gaps and monitor R&D advancements to ensure Gap Closure and/or PCB Design Change in support of future PCB trends and stated needs. The participants in the forum will report briefly on their program and solicit feedback as to how working together the OEM Council can cooperatively collaborate on projects. This meeting is open to all attendees of IPC Expo/Apex.