Industry’s first ultra fine pitch bondtester to be shown at APEX

Dage Precision Industries will introduce the Series-5000 Bondtester to the PCB assembly industry at the APEX Conference and Exhibition (February 24-26, Anaheim, CA). The Series-5000 is specifically designed to meet the demands of testing ultra fine pitch (UFP) wire bonded devices. The Series-5000 is capable of testing bonds at pitches of 50 micron pitch and below., and is an evolutionary advance from Dage’s industry leading Series-4000 Bondtester,. The Series 5000 includes a number of major advances such as leading edge optical systems to help the operators align and grade the bonds, ultra low force transducer systems and unique shear and pull tooling to minimize lead and ball damage. The 5000 Bondtester is the first of its type to specifically address the demands of UFP device bond testing including shear and pull test at pitches of 50 microns or less. A number of the Dage-Series-5000 features are available can be used on the Series-4000. This means you can upgrade your 4000 to accommodate 5000 options or use existing 4000 options on your Series-5000"The 5000UFP represents a major development in the evolution of ultra-fine pitch wafer bond testing," comments Dage’s Managing Director, Paul Walter. "It eliminates any form of human contact with bumped wafers and increases test reliability, safety and avoids scrap due to handling induced defects."Source: PCBnewsline