JPSA Laser announces high-speed blue LED wafer scribing under $2/wafer

The new JPSA ChromaDice™ UV diode-pumped solid-state (DPSS) Laser system delivers high-speed blue LED wafer scribing with typical yields greater than 99% at less than $2 per wafer. This system cuts a well-defined, square chip, with consistently narrow cuts as small as 5 microns. With its high throughput – up to 8 wafers per hour – and minimal impact on LED performance, the process is tolerant of wafer warp and bow; and delivers very fast scribing speed compared to mechanical scribing. With the ChromaDice™, there are no process consumables; one achieves higher yields at lower operating costs, with full automation possible and its attendant higher precision. A single operator can run multiple systems with no impact on process yield. Automatic alignment is rapid, < 1 minute to load and align with the system’s patent-pending optical system.The operating cost of the JPSA ChromaDice™ system is estimated at less than $2 US per wafer with uptimes easily exceeding 99%, 24/7 maintenance-free operation. Compared to mechanical scribing, the DPSS laser process provides improved wafer throughput by 500%, with a 97.5% reduction in operating costs.With the ChromaDice™, the only consumable is electricity, although periodic laser refurbishment is required; however the cost per wafer is minimal. Narrow cut widths and consistent alignment allow street widths to be reduced, increasing the die count per wafer. The ChromaDice™ system is operated by the user-friendly Windows® 2000 interface. UV DPSS laser scribing is poised to replace diamond scribing for die separation on sapphire wafers. 266nm DPSS laser scribing with the ChromaDice™ represents the state of the art in blue LED die separation. Source: PCBnewsline