New ProFlex technology from DEK

New ProFlex technology, introduced by DEK, claims to enable high accuracy mass imaging to surpass resolutions of 150 mm in commercial volumes. By extending process capability in this way, DEK has opened the door to high volume manufacturing of next generation component packages requiring fine-pitch area grid arrays, and to SMT assembly of next generation chip-scale packages.ProFlex will be available as a factory fitted option for new machines, and as a machine performance upgrade (MPU) to machines already in the field. It is the result of in-depth studies into stencil behaviour during the separation phase. "ProFlex changes the way the stencil moves during the separation phase, dramatically improving paste release and opening the door to ultra fine-pitch applications in high volume manufacturing," said DEK’s Andy Ure, who led the ProFlex development project. "We also believe this is the key to challenging the stencil design rules for next generation applications," he concluded.Source: PCBnewsline