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DuPont PCB materials exhibits at Productronica

Nov 11, 2003

DuPont Printed Circuit Materials will be featuring its latest technology developments in primary imaging for PCB fabrication at Productronica, this week in Hall B2, Stand 556. Three new advances in DuPont™ Riston® dry film photoresist technology will be exhibited. Riston® PlateMaster PM200 is the latest generation high yield, high productivity dry film targeted principally for the plating of copper, tin, and tin-lead. It is particularly suitable for fabricators seeking a tough, fast, clean stripping film capable of high resolution and volume production on a wide variety of surfaces. For specialized applications, two DuPont™ Riston® Special FX series films, developed in Japan, are taking technology to extremes. Riston® FX250 is a key enabler for selective surface finishing with the ENIG (Electroless Nickel Immersion Gold) process. Riston® FX900 series has been purpose-designed for the high yield, volume production of fine geometry's in the 50-75 µm feature size and below. Also featured will be DuPont™ Riston LaserSeries high speed laser direct imaging (LDI) photoresists. Riston LaserSeries films allow fabricators who are investing in LDI technology to maximize their return by allowing their LDI systems to run at their greatest capability. Riston LaserSeries films are compatible with all commonly used UV laser imagers and functional in all major printed wiring board applications. DuPont™ ImageMaster™ IMD diazo phototools and DuPont™ Vacrel® dry film soldermasks complete the full range of products which DuPont Printed Circuit Materials offers for the primary and soldermask imaging processes. Source: PCBnewsline

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