Dage sets the Benchmark with Ultra Fine Pitch Bondtester
Nov 13, 2003
Testing at 50µm and BelowWith over 30 years experience in the testing of wire bonds, Dage Precision Industries has recently launched the Series 5000 which is specifically designed to meet the demands of testing ultra fine pitch (UFP) wire bonded devices. Based on their highly successful series 4000 bond tester, the Series 5000 features a number of benefits that are designed to make this level of testing more reliable and accurate.Wire bonding at 25µm and below is proven in laboratories, including the shear and pull testing of these wires. Although it is possible to test these geometries with current test solutions, their ease of use and accuracy are being pushed to and, in some cases, beyond their limits. Capable of force measurements between 0 – 25gf, the system suffers no proportionate loss of accuracy and boasts improved control for the sample and tool manipulation. Added to this is the improved optics and illumination to enable easy alignment of the tool to the sample and improved tool designs that have been optimised for the changing shape of today’s ultra fine pitch bonds.An enhanced anti-vibration design also allows the Series 5000 to be largely unaffected by the ambient vibration around the test area that becomes far more critical at these smaller sizes. Improved step back accuracy when shear testing ensures that the shear height does not become too large or too small, resulting in the tool dragging on the substrate. This new sub-micron ability has resulted in the first dedicated solution to the testing of such small wire bonds.