Henkel introduces new die attach adhesive

Henkel Loctite Corporation has introduced Hysol® QMI 550SI, a low-CTE, silica-filled, dielectric die attach adhesive designed to bond non-active package surfaces such as bottom-die-to-substrates and die-to-dummy-spacer-die in same size stacked die packages. Hydrophobic and stable at high temperatures, QMI 550SI produces void-free bond lines with excellent adhesion strength to a wide variety of organic and metal surfaces including polyimide, BT, FR, and Au. Packages manufactured with this non-conductive adhesive have high resistance to delamination and popcorning after multiple exposures to reflow temperatures. QMI 550SI allows SkipPrebake and can be cured in-line using SkipCure processing in just 10 seconds after the bond line reaches 150°C. The product is a cost effective manufacturing solution due to the higher UPH that can be realized through SkipCure, skipping prebake, and using organic spacers. QMI 550SI is JEDEC Level 3 capable for 260°C reflow in tape array BGAs. The product may be converted to a controlled collapse spacer paste that employs Loctite® patented organic spacers. Source: PCBnewsline