LPKF releases Pulsonix chip packaging toolkit

LPKF Laser & Electronics has announced the release of the Chip Packaging Toolkit option for Pulsonix PCB design software. With the release of this option, Pulsonix is now able to target chip packaging and chip-on-board designers. Pulsonix Chip Packaging Toolkit provides the option to create and annotate die, bond pads and bond wires, and also allows the automatic placing of bond pads around bare die components. Online DRC (design rule check) and batch design rules can be set for minimum and maximum length of the bond pad from the die pad, and for crossing over of insulated and non-insulated wires. Stephan Schmidt – Vice President of LPKF Laser & Electronics North America said, "The new Chip Packaging Toolkit is another exciting enhancement for Pulsonix, extending the capabilities for our customers who create designs using bare die technology." Source: PCBnewsline