More improving news from Taiwan

Radiant Technology Corp.’s WaferBump Oven was chosen over the competition for its reliability and lower bump voidingRadiant Technology Corp. has announced that a major Taiwanese subcontract assembler and bump fab has ordered its second WaferBump™ Oven System, which, says RTC, was chosen primarily because of the significantly lower bump voiding afforded by infrared conduction heating technology. The system follows the first which was installed in summer last year."Conductive heating has been shown to be the preferred mechanism for reflowing solder on wafers," said Dr. Raymond Kruzek, Vice President of Business Development for RTC. "That combined with the benefits of IR heating makes the WaferBump Oven system the most versatile, flexible reflow tool available."Source: PCBnewsline