New mass imaging process from DEK

DEK has announced it has successfully applied mass imaging techniques to improve the uniformity of Thermal Interface Material (TIM), deposited between a silicon die and its package lid during semiconductor packaging processes. By mass imaging the TIM using ProFlow DirEKt Imaging, semiconductor manufacturers can now be sure that the die surface is covered by a uniform thickness of TIM. Advantages include better thermal connectivity between the die and the lid, which improves reliability, as well as greater coplanarity of the lid.DEK will also soon conclude development of a lid sealing process that will complement its TIM deposit process to create a complete mass imaging solution for lid attachment.Overseeing the project, DEK’s David Foggie said, "The results from our first customer trials have shown that mass imaging is significantly more controllable and repeatable than traditional dispensing when depositing TIM."Mass imaging also allows the shape of the TIM deposit to be more accurately controlled, and more repeatable. The thickness of the initial deposit is also more uniform across the surface of the die. Because the process does not rely on placing the lid to spread the TIM, flaws such as voids in the material or incomplete spreading are eliminated. This is very important to semiconductor manufacturers and packaging specialists, since these flaws are very difficult to inspect after the lid has been placed.Source: PCBnewsline