Henkel Loctite introduces underfill for low k flip chips

Henkel Loctite Corporation has introduced an advanced underfill material that is said to offer enhanced properties for leading edge semiconductors that use low k inner layer dielectric materials for wafer fabrication. Formulated specifically for flip chip packaging, Hysol® FP4580 prevents cracking and delamination of the chip’s fragile inner layers. Henkel Loctite worked closely with LSI Logic Corporation to develop and test Hysol FP4580, a high purity, low stress liquid epoxy. The product claims to offer excellent performance on copper/low k flip chip laminate packages up to 50 x 50 mm with over 4000 bumps. The underfill’s physical properties are optimized to balance low stress at the inner layer of the chip with low strain on solder bumps. Maniam Alagaratnam, LSI Logic vice president of Package Development: "This new underfill is a key component of our flip-chip packaging solution for high performance applications, particularly those using a true low-k (Er < 3) technology. Henkel’s advanced underfill material meets our needs in maintaining our leadership position in advanced packaging." Source: PCBnewsline