Polyonics introduces new generation of polyimide labels
Sep 05, 2003
Polyonics Inc. has introduced a new generation of ultra-high-temperature labels under the Polyimide family of label materials.
Polyonics XF-581, XF-582, XF-583 and XF-584 are all described as suitable for lead-free electronics applications, and are all available in colored versions. Additionally, the family of Polyimide label material is designed for barcode or alphanumeric identification of printed circuit boards or related electronic components.
It is said to be the ideal label to withstand mixed circuit board processes, on either the top or bottom side of the board. The family features excellent resistance to harsh fluxes, cleaners, saponifiers and wave solder environments, and resists all commonly used methods of cleaning.
When used with the proper ribbon, the Polyimide labels pass MIL-STD-202F method 215J. The printed Polyimide label resists smearing, even when the board and label are directly removed from a reflow or wave solder environment.
All the products are a Polyimide label material coated with a permanent pressure-sensitive acrylic adhesive and a high opacity, medium gloss white topcoat designed for thermal transfer printing.