2nd call for papers for ICEPT 2003

April 21-23, 2003 Shanghai, ChinaThe Chinese Institute of Electronics (CIE-CEPS), has announced their sponsored event; the Fifth International Conference on Electronic Packaging Technology (ICEPT 2003), which has been organized with the intention of providing a forum for the presenting and discussion of the latest development in electronic packaging technology and related fields.A Call for Papers has been issued. Papers that deal with all aspects of electronic packaging are being sought. Topics include advanced electronic packaging technologies, material characterization, MEMS and packaging design, modelling and simulation.Prospective authors are requested to submit a 500 to 1000 words summary inEnglish with no more than 4 figures for review by Email. The title page should include an abstract and the authors' full addresses (Email address, Telephone and Fax numbers). The summary should be sent to: Mr. Guowei He icept2003@ vip.163.com or Fax: 86-21-65103056 by Jan. 21st , 2003 .Source: PCBnewsline