Datacon`s telecom application selected by Skyworks

Multi-chip bonders purchasedHigh-precision semiconductor production systems provider Datacon North America, Inc., has announced that it has recently received an order from Skyworks Solutions, Inc.Skyworks has purchased multiple Datacon 2220 apm Multi-Chip Die Bonders for the company’s assembly and test facility located in Mexicali, Mexico. Skyworks will use the Datacon equipment to produce SiP power amplifier (PA) modules for their growing mobile communications products business.Skyworks is a new customer and another important success for Datacon in the telecommunications market. After an intensive evaluation process, the company are said to have selected Datacon’s equipment due to its ability to meet critical die attach process parameters while maintaining high throughput in a cost-effective solution.Source: PCBnewsline