IPC and JISSO sponsor technical seminar - Implementing Advanced Interconnect Technology Solutions
Feb 25, 2008
IPC and the Jisso International Council (JIC) are sponsoring a technical seminar, May 21–22, 2008, to provide information on the latest trends in interconnection technologies used in electronic products. The seminar will be held in conjunction with the second Jisso International Forum, hosted by Georgia Institute of Technology in Atlanta. During the technical seminar, members of JIC, as well as technology leaders from industry will cover environment-friendly manufacturing, three-dimensional integration, interposer substrates, and standards activities.
Session topics will include: overviews of total packaging solutions, reliability and quality, printed and embedded electronics, nano materials, and more.
"Attendees will get a comprehensive view of both integrated electronics development and manufacture, in addition to valuable inputs on interconnect technologies that will impact the electronics industry over the next ten years," says Jean Hebeisen, director of professional development. "Participants will definitely gain a firm understanding of the key issues impacting electronic interconnections."
For additional information on the technical seminar or to register, visit www.ipc.org/JF0508