APEX Exhibitor Preview I

                            
In less than two months the electronic manufacturing industry will decend on Las Vegas, IPC's latest venue for the APEX show. Below are some of the exhibitor highlights for the event, which will be held on the 1st to 3rd of April. If you would like your company to be included in subsequent previews please send your infomation to editors@emsnow.com


Aqueous Technologies - Booth 2431

Aqueous Technologies Corp. will highlight the Trident, its fourth-generation automatic defluxing system, and Trident II. The Trident Series represents the next generation of lead-free compatible, fully automatic post-reflow defluxing systems.

Michael Konrad, Aqueous Technologies' president and CEO, said, "Trident represents a culmination of more than 20 years of batch-format defluxing equipment experience."

Trident automatic defluxing system is the fastest batch-format defluxing system available. Trident's specific throughput rate is determined by equipment model and user's board size. Trident is available in four throughput configurations, the highest is capable of defluxing and cleanliness testing up to 896 4 x 6" (101 x 152 mm) boards and up to 112 18 x 20" (457 x 508 mm) boards per hour.

The most flexible defluxing system available, Trident also offers several defluxing configurations designed to provide complete compatibility with all defluxing requirements. The system's defluxing process consists of up to five cycles including prewash, wash, rinse, cleanliness testing and drying.

Trident is equipped with an automatic chemical management system that automatically measures and doses concentrated defluxing chemicals into the wash-solution recirculation system. The wash solution is captured and reused, eliminating routine chemical discharge. Level gauges indicate the available levels of wash solution and concentrated chemical.

Also on display during APEX will be the Trident II, which features all the same features as the Trident, but is also capable of removing all flux residues including rosin, no-clean and water soluble.


Ascentech - Booth 241

Ascentech, LLC, North American distributor for the GEN3 Systems Ltd. products, will introduce new solderability test equipment.

The premier new product is the ShareGen SPA 1000 Solderpaste Analyzer, which provides fast and accurate testing to help control and manage solder paste in the production process. It helps reduce a range of defects including missing components, tombstoning, component misalignment, non-wetting etc., thus greatly reducing inspection and rework time and cost, thereby increasing profit.

The SPA 1000 Solder Paste Analyzer is a unique 6-in-1 solder paste test system that can perform up to six separate tests that would previously have been performed by separate instruments, in accordance to IEC 61189-5 and IPC-TM-650 standards. It represents a unique "All-in-One" test system. The system can also be used to conduct solder paste "Open Time" testing.

Ascentech will also exhibit the MUST III Solderability Tester, a wetting balance testing system capable of testing to all relevant solder standards including ICE, MIL-STD, IPO/EYE/JADE, etc. The MUST System 3 measures the solderability of a printed circuit board and/or component's metallic terminations by documenting the wetting curve of the unit under test. The MUST System 3 is appropriate for testing all devices including multi-leaded components as well as SMT and BGA devices.

Ascentech will also exhibit CM-Series Ionic Contamination Testers.


Asymtek - Booth 511

Asymtek will introduce its next generation conformal coating platform, the Select Coat® SL-940E.

With up to 30 percent faster throughput, a vision system, closed-loop process controls, traceability, and advanced integrated software, the Select Coat SL-940E provides high quality and increased productivity in a high-speed, high-accuracy coating system.


With the Select Coat SL-940E, advanced monitoring makes it easier to keep the coating process in control. Fluid and air pressures are set and monitored through software-controlled electronic regulators, allowing traceability for these critical parameters. Data logging and automatic adjustments of other parameters such as fan widths and fluid temperatures further ensure the quality of the coating process.

The SL-940E has a large dispense area of 500 x 475 mm (19.7 x 18.7 in.). The enlarged work area enables flexibility during production to add multiple board arrays or to coat large substrates. Programming is made easier with the optional camera and pattern recognition system.

A variety of fluid delivery options are available to accommodate a wide array of fluids and applications. These include the heat circulating Viscosity Control System (VCS) and the SC-204 and SC-205 film coater modules, both of which are non-atomizing systems. The Swirl Coat SC-300 applicator is a three-mode swirl system, while the PreciseCoat™ SC-400 Jet Applicator can be used for high selectivity applications.

www.asymtek.com  


BPM - Booth 2245

BPM Microsystems will display its latest Flashstream automated programming technology, the 3000FS.

Designed specifically to solve excessive programming times in current in-system, JTAG and in-circuit programming production methods, the 3000FS is modeled from the current BPM 3710 handler and contains four Flashstream programming sites. Rated at 1050 devices per hour, the new 3000FS is flexible enough to handle parts in tray, tube or tape for device input or output.

"Combining these two technologies gives the 3000FS automated flash programmer the ability to produce a fully programmed 512Mb NAND Flash memory device every 3.4 seconds or 1050 devices in an hour" says Tim Nolte, director of global marketing. "Our customers will get the benefit of a robust device handling solution combined with Flashstream's speed to meet the challenges of large flash memory programming in electronics manufacturing."

Also on display will be the HelixFS, modeled after the BPM Helix tabletop handling system. Rated at a delivery of 800 devices per hour, the HelixFS gives customers the option to utilize Flashstream sites or purchase and use BPM's current universal site technology that supports over 26,000 device part numbers. The HelixFS has the ability to switch between the dedicated flash sites and universal sites, to adapt to production needs.


CeTaQ Americas - Booth 1828

CeTaQ Americas will highlight the CmController5 Compact (CmC5 Compact) measurement and analysis tool.

CmC5 Compact is designed as a universal measuring and analysis tool for SMT production. This dedicated tool for machine and process capability analysis includes a complete measurement system with measurement software for vision and statistical analysis. Additionally, it helps users analyze and optimize the production process with an error rate reduction.

The tool features an attractive and rugged design in order to meet customer demands of measurement precision, mobility, speed, flexibility and ease of use. The standard version is ready to use for all SMT pick-and-place machines, and all of the glass boards designed by CeTaQ fit into the CmC5 Compact without any additional tools. It is possible to expand the system's functionality with additional hardware and software. The Machine Capability Analysis (MCA) test for printers also can be directly controlled by the system.

Featuring low-cost machine acceptance test, fast error correction, and preventive and predictive maintenance planning, CmC5 Compact provides measurement on site, ease-of-use, and dedicated tools and comprehensive software.

CmC5 Compact offers users significant benefits including quick return on investment, a third-party independent method, productivity and efficiency improvement, significant defect reduction, and validation for ISO, IPC and Automotive standards. Additionally, the tool is suitable for all major SMT machines.


CyberOptics - Booth 611

CyberOptics Corporation will showcase its Flex Ultra High-Resolution automated optical inspection system (AOI).

Winner of the 2007 Global Technology Award, Flex Ultra HR is an enhanced resolution AOI system with inspection performance for 01005 components and larger. As one of the highest-speed inspection systems in the industry, Flex Ultra HR is ideal for assembly lines producing memory, notebook, mobile phone, and automotive product.

Base system features include high-speed pre- and post-reflow inspection capabilities, patented SAM™ vision technology that learns as the process varies providing the lowest escape and false-call rate combination in the industry. This software also enables the ability to inspect any component or feature such as chips, ICs, empty locations, lead-free solder joints, gold fingers, connectors, clips and screws. Recent system enhancements include bar code reading with system cameras, dual-stage defect review and repair, and lot management improvements.

CyberOptics will exhibit its easy-to-use operator user interface (OUI) for the Flex Ultra HR. The new OUI for inspection and defect review provides operators a simple, intuitive graphical user interface with a look and feel similar to the user interface on the CyberOptics SE 300 solder paste inspection machine.


Datapaq - Booth 1438

The Datapaq Surveyor will be showcased. The Surveyor provides and easy and accurate way to monitor the thermal performance of your reflow oven every hour, day and shift - effortlessly. With its special sensors and SPC analysis, the Surveyor automatically identifies out of tolerance conditions before they become a problem. This system eliminates your need for test boards, while simplifying your profiling process.

Consisting of fixed sensors that eliminate the variables associated with thermocouple attachment, an adjustable frame that rides on the oven's rail or mesh belt, and the all new surveyor software that automatically stores your profiles for easy analysis - this is the industry's most reliable oven performance monitor.

www.datapaq.com  


DEK - Booth 1659

DEK's Horizon print platform blends high-end functionality and value for manufacturers at every level, enhancing cycle time, yield and flexibility through a range of premium features and advanced performance options.

The multi-level platform is built on an optimised printer frame, engineered to ensure mechanical and thermal stability, while advanced motion control mechanisms, rapid setup and changeover capabilities guarantee a high level of speed and precision.

DEK's Instinctiv™ V9 software is engineered to maximise machine utilisation, process control and operator efficiency.

Significant improvements have now enhanced Instinctiv's ability to enable faster set-up and reliable first-time print, lower operator training requirements, easier error avoidance and recovery. Enhanced parameter editing, command availability and real-time feedback are now built into the system to streamline new product introduction, monitor complex processes and reduce stoppages.

Reel-to-Reel from DEK is a breakthrough new platform enabling precision printing onto continuous substrates such as flexible printed circuits and advanced synthetic materials. Accurate, cost-effective and versatile, this is a complete process solution for the deposition of advanced materials used in applications such as lighting systems, automotive instruments, mobile phones, RFID tag technologies and notebook PCs.

www.dek.com  


Europlacer - Booth 1624

Europlacer will feature a dual-gantry Xpress 25 flexible high-volume SMT placement system. Xpress 25 brings new vision to modular placement - combining high-speed and fine-pitch capabilities within a remarkably compact footprint. Unlike conventional high-end placers, the twin headed Xpress 25 can place a wide array of devices ranging from 0201 to 2.74" sq QFP/BGA at a tact time of 0.144 sec (25,000 cph equivalent, IPC: 18,900 cph). Equipped with "smart nozzles" and on- the-fly vision, Xpress 25 gives users a genuine single machine solution OR an extraordinarily simple line speed enhancement when placed in-line with existing assemblers.

The flexible placement system features numerous key benefits including a significant protection of investment, intelligent feeder technology, "smart" nozzles, broad component processing range and more.

Offering users a feeder capacity of 92 x 8 mm, the dual-gantry Xpress 25 has an accuracy of ï??0.0014" (QFP) to ï??0.004" (chip) at 3 Sigma. Additionally, the system features a minimum pitch down to 0.012" and a tape size range from 8 to 88 mm.

Various options are also available for the system: intelligent tape feeders, intelligent tape trolley, intelligent belt feeders, intelligent beltfeeders, intelligent internal matrix tray, intelligent matrix tray sequencer, tape trolley, offline storage trolley, component test verification, barcode reader, fixed upward vision camera and comprehensive software for factory management and efficiency.


EVS International - Booth 263

EVS International will introduce the EVS 7000 and EVS 9000 solder recovery systems in distributor Sono-Tek's booth.

The EVS 7000 and EVS 9000 systems are part of the EVS Series, which represent a quantum leap forward in the processing of solder dross. The series' sleek lines confirm the streamlined systems, advanced electronic controls and integrated diagnostics. Extensive feedback from the market has enabled EVS International to offer machines that satisfy the high standards required from a modern manufacturing environment particularly with regard to reliability, ease of operation, maintenance and environmental management.

The EVS 7000 and EVS 9000 have been designed like the newly launched EVS 1000, and have integrated all of the new-generation system's features, enhancing the performance of previous units. The smaller size, footprint and much easier access for maintenance help reduce the cost, giving a rapid payback and impressive return on capital employed.

Offering capacities of 10 kg/20 lb (EVS 7000) up to 20 kg/44 lb (EVS 9000), the new EVS 9000 system has the facility for single operation dedrossing of even the largest wave soldering machines. Its large integrated hopper makes rapid transfer of dross both simpler and safer, and speeds dedrossing times by up to 75 percent. This provides a cleaner wave with less maintenance, less downtime, and a reduction in shorts and bridging as well as the potential to discontinue the use of messy wave oils and/or dross reduction powders.

The new EVS platform is designed for simple, one-person operation on the shop floor using existing staff. There are no complex installation procedures, just plug it in to a single-phase supply and a six bar airline and it is ready to go.


FCT Solder - Booth 243

FCT Solder, a division of FCT Assembly will introduce NC162 SN100C® No-Clean Flux.

NC162 is a third-generation liquid flux developed in response to the need for a high-activity halide-free no-clean alloy with superb solderability and minimal post-process residues, especially in palletized processes. NC162 works especially well with FCT Assembly's SN100C Sn/Cu/Ni+Ge lead-free alloy, and is an excellent choice for soldering through-hole and mixed-technology assemblies.

NC162 has been formulated to provide the following benefits: halide-free, fully lead-free compatible, low post-process residues and excellent activity to promote hole fill. Additionally, the alloy becomes more robust in high-temperature applications, and can be sprayed, foamed, or dipped.


ESSEMTEC - Booth 501

Essemtec will debut the FLX2010-BLV SMD pick-and-place system.

FLX2010-BLV addresses both the requirements of prototyping and series production. The batch-type pick-and-place machine allows for faster loading/unloading of PCBs compared to systems without a conveyor. The system automates PCB handling like an inline machine but offers 50 percent more feeder capacity as a batch type. The FLX2010-BLV system is capable of processing small components (01005 chips) up to large-size PCBs (30.7x23.6").

The FLX2010-BLV pick-and-place system has been developed for users requiring more feeder capacity than inline systems can offer but prefer the convenience of an automatic transport system. The solution is a batch system with a one-side conveyor. The PCB is manually or automatically placed onto the conveyor, which drives it into the machine. The PCB automatically aligns itself by reading fiducial marks. After successful component population, the PCB is driven out to the same side of the machine.

FLX2010-BLV is part of Essemtec's successful FLX series, which is designed for high-mix production. All feeders are intelligent and can be exchanged during machine operation, making product changeover easy, fast and secure. The graphics-based software concept supports an extremely easy machine operation so that usage and programming can be quickly learned.

The FLX Series pick-and-place machines are flexible systems that provide advanced solutions. They process all component types (chip, QFP, BGA, etc.) in all common sizes (01005 up to 50x50 mm) and from all package types (tape, stick, tray, special forms). The machines use image processing technology from world leader Cognex for alignment. Therefore, even a QFP with a lead pitch as small as 0.3 mm can be placed accurately. Machine speed is 5000 cph and the systems can process PCBs as large as 780x600 mm (30.7x23.6").

The FLX Series offers many modular add-ons. For instance, an integrated paste and glue dispenser can save stencil costs for prototyping and increase flexibility. Additionally, the MIS software package offers tools for production planning, feeder optimization and quality assurance, and enables the planning and control of the component stock. Connection to an existing ERP system also is possible.


Finetech - Booth 577

FINETECH will display the Fineplacer® CRS 10 Compact Rework System. FINETECH's complete rework station is designed specifically for customers needing a fixed configuration, with quick set up and easy operation.

It is most useful for small- to medium-scale series assembly or highly precise rework of soldered components on medium to large size SMD boards. Applications include BGA, CSP, microBGA, MLF, QFP, TSOP, PLCC, small passives, connectors, RF-shields, shielding frame, flip chip rework as well as customized applications.

The rework station features a Plug-and-Work design, eliminating the need for time-consuming cabling. Additional features include a patented Vision Alignment System with stationary beam splitter, controlled Z-height during reflow, a reliable rework process, proven soldering head technology, and an automated component place and lift-off function. The Fineplacer® CRS 10 is equipped with a sophisticated Controlled Mixed Soldering System reflow module for top heating and high-performance full-area bottom heating.

Very high accuracy (better than 10 µm placement accuracy) allows the system to be used for the smallest components with pitches down to 100 µm. On the other hand, the large field of view makes it possible to align large components, without additional optics.

Additional characteristics include lead-free approved, very high reproducibility, no operator influence during the process, low cost of ownership and much more.


Henkel - Booth 634

Loctite® 3508 is a one component epoxy that is pre-applied to the board at the corners of the CSP pad site using a standard dispensing system.

Unlike capillary flow underfills which require dedicated equipment and subsequent process steps, Henkel's Loctite 3508 can be applied in-line using existing capital equipment with curing taking place during the normal solder reflow process, thus delivering considerable cost savings and dramatically improving throughput. The material allows for device self centering, is lead-free compatible, reworkable and is remarkably stable with a pot life of greater than 30 days.

Henkel has launched its latest thermal product, PowerstrateXtreme™ Dispensable (PSX-D). As a paste medium, Henkel's PSX-D alleviates the challenges associated with phase change films and the shortcomings of thermal greases by incorporating phase change performance into a liquid product, allowing for superior thickness control and considerable manufacturing flexibility. The material also delivers process adaptability, as PSX-D can be needle dispensed or manually applied onto a heat sink or other surfaces, eliminating the need for additional equipment investment and improving throughput.

PowerstrateXtreme Dispensable has been optimized as a TIM2 material for use between microprocessors, IGBT, FBDIMM/Memory, GPU, multichip modules, ASICs and their active heat sinks. The material is also re-workable and repeatable making it especially cost-effective for both lidded and bare die processor applications.

www.henkel.com  


High-Tech Conversions - Booth 2085

High-Tech Conversions Inc., a manufacturer of wiping products and a supplier of consumable items used in cleanrooms, assembly lines, laboratories and manufacturing, will feature its lead-free compatible, ESD stencil wiping rolls.

High-Tech Conversions' GREEN MONSTER ESD stencil wiping roll is the only stencil wiping roll that is truly antistatic as well as lead-free compatible. Because the material is ESD, it prevents sparks that can damage components and cause voids in solder traces.

Because GREEN MONSTER uses coarse ESD fibers, the fabric has a much more aggressive cleaning surface and provides more voids to collect solder paste as opposed to the smearing that results from using paper. The fabric is made of a highly cross-linked acrylic polymer that bonds the company's long, coarse fibers together, making the product more porous and allowing full utilization of the vacuum system. Consequently, more air can be drawn through the stencil's apertures solder paste.


Inovaxe - Booth 2270

Inovaxe Corp will exhibit INOCART-MSD, a true solution for managing moisture sensitive devices (MSD).

Through its innovative individual cell design, INOCART-MSD effectively manages multiple component reel sizes and waffle trays in a low relative humidity safe storage condition.

Included with each INOCART-MSD is the company's revolutionary MSD tracking and timing software solution. This advanced solution continues in the Inovaxe philosophy of inventory control through ONE PACKAGE/ONE LOCATION.

Available in two configurations, 66 individual cells and 33 individual cells, INOCART-MSD provides users with numerous technological features, including cells that disengage from the centralized "hive" when the door is opened, allowing environmental control to be maintained in all of the other cells. This design feature eliminates factory ambient exposure to all other components in the safe storage condition.

The system uses multiple forced convection desiccant drying modules that are capable of reaching very low humidity levels. The multiple drying modules allow for the automatic regeneration (drying) of the desiccant. The low relative humidity levels attained by the INOCART-MSD allow the system to effectively manage MSD levels of 2, 2a 3, 4, 5 and 5a. The digital display shows temperature and relative humidity percentage within the material handling system.

The INOCART-MSD included software features benefits unavailable with other material handling systems. The MSD tracking software triggers when a package is moved from "safe storage" to "factory ambient" conditions and starts progressing remaining floor life in accordance with its specific MSD level per J-STD-033A.


Juki Corporation - Booth 2025

Juki Corporation will showcase two Juki FX-3 chip shooters.

The FX-3, rated at 60,000 CPH, will be shown in a line that includes two FX-3 chip shooters and a new KE2080 flexible mounter. The rated speed of the line will be 135,400 CPH and will demonstrate minimum footprint and maximum flexibility by being able to place parts ranging from a 01005 (0402 metric) chip using the new LNC-60 high-resolution 360° component laser centering system to a 50 x 150 mm connector.

The FX-3 will mark the entrance of Juki into ultra-high-speed assembly lines and will introduce Juki's standards for high quality, reliability and cost of ownership. The modular FX-3 fits seamlessly into Juki's portfolio of products and adds its powerful optimization software and quick-change feeder banks to set the standard for electronics manufacturing uptime.

www.juki.com  


Kester - Booth 1660

Kester will be featuring numerous products from its Lead-Free Solutionsï?? (products and services) portfolio to help companies in the transition to lead-free. Among products being featured will be low-cost Ultrapureï?? K100LD lead-free bar and wire solder alloy and its EM907 paste along with Kester's technical services to help manufacturers assemble lead-free.

K100LD is a patent-pending, low-cost alternative to traditional lead-free alloys that is available as bar solder or wire solder. The material offers the lowest copper dissolution of any lead-free bar on the market, even amongst all common alloys, including Sn63, SAC305 and other lead-free options.

K100LD represents an improvement over competitive alloys, including other variations of Tin-Copper-Nickel (SnCuNi). K100LD is a low-cost (silver-free) lead-free alloy primarily containing tin and copper with the inclusion of metallic dopants to control the grain structure and the Copper dissolution rate. K100LD has a slower rate of Copper dissolution than competitive SnCuNi alloys, which minimizes pot maintenance, maintains consistent soldering performance and improves reliability.

K100LD has a copper dissolution rate 20 percent slower than the competitive SnCuNi alloy and even Sn63Pb37. K100LD compares favorably to other low-cost, lead-free alloys in terms of wetting and flow characteristics, providing users with optimal soldering performance and minimal defects.

In addition to K100LD, Kester will showcase its EM907 No-Clean Lead-Free Solder Paste, which is designed to exceed customers' expectations for high-yield lead-free manufacturing. EM907 is specifically for the higher thermal demands of assembling with higher melting temperature lead-free alloys, such as the family of SnAgCu (SAC) alloys.


KIC - Booth 1977

KIC will highlight the Auto-Focus Power option for reflow ovens and wave solder machines.

This next-generation thermal process optimization system "googles" available oven recipes and automatically selects the most optimum process for individual applications. The standard Auto-Focus automatically selects the recipe that positions the process in the center of the process window, or alternatively the fastest throughput. The new, advanced Auto-Focus Power software product adds a third optimization criterion, namely by selecting the recipe that yields lower energy consumption.

Third-party research has verified the ability of the Auto-Focus Power option to reduce energy consumption. This key feature results in significant cost savings in today's environment of increasing energy prices.

www.kicthermal.com  



Kyzen Corp. - Booth 2219

Kyzen Corporation will exhibit AQUANOX A4625B, an innovative aqueous chemistry designed for optimum effectiveness in batch washers. This easy-to-use product will remove all types of electronic flux residues including the latest lead-free. A4625B is environmentally friendly, has a long tank life and low maintenance cost. Additionally, it will provide brilliant mirrored finishes even after multiple cleaning cycles.

A4625B is used at low concentrations for optimum cleaning efficiency without damaging delicate substrates. A non-flammable, non-corrosive liquid, A4625B has proven compatible with all materials commonly used in electronics assembly manufacturing and cleaning processes.

AQUANOX A4625B is a biodegradable low-VOC aqueous solution that contains no CFCs or HAPs. The Kyzen Applications Laboratory has evaluated AQUANOX A4625B for effective removal of nearly 300 soldering materials from the world's leading suppliers including, Senju, Alpha, Kester, Indium, Aim, Koki, Nihon Superior, Amtech, Cobar, EFD, Florida Cirtech, Formosa, Heraeus, Interflux, Metallic Resource, Multicore, Promosol, Qualitek and Shenmao.

AQUANOX A4625B is available in one, five and 55 gallon containers.

www.kyzen.com  


Nihon Superior - Booth 249

Nihon Superior's unique SnCuNiGe solder, SN100C®, that has established itself as the best alloy for lead-free wave soldering, will now be available as a high-performance solder paste with a general purpose "P500" flux medium.

Because of its high fluidity close to its melting point and fast wetting, SN100C P500 can be used as a drop-in replacement for SAC solder paste in reflow profiles that peak around 240°C. However, it brings to reflow soldering the advantages that have made SN100C such a popular choice in wave soldering, i.e. smooth shiny fillets with no shrinkage defects, high ductility and stable intermetallic with consequent superior performance under vibration, and impact loading. The P500 no-clean halide-free medium delivers excellent printability, long stencil life, good tack, excellent reflow and wetting on all substrates with no solder balls and minimal clear residue.


Ovation Products - Booth 2471

Ovation Products will introduce its new "Stinger" fluid dispense system.

Charles Moncavage, GM, has reported that the company's patent pending dispense module will expand the capabilities of conventional screen printers by enabling the user to dispense SMT adhesive or solder paste on a PCB, immediately following the screen print operation while it is still in alignment from the screen print.

The small and lightweight dispense module is coupled to the printer's vision system by an electro-pneumatic interface that allows the entire module to be removed and reinstalled on the printer in seconds for ease of maintenance and material changeover. Once the PCB is screen printed (as normal), it is separated from the stencil and lowered back to "vision height" at which time the camera/Stinger will accurately dispense adhesive or paste (from industry standard cartridges) on a virtually unlimited number of user-defined sites while dynamically adjusting the dispense tip height, in case of board warpage, with its laser compensating servo-controlled Z-axis.

The system is field retrofit capable and eliminates the need for the added floor space, cost and maintenance associated with a dedicated inline dispenser. Additionally, Stinger technology is said to save time and improve quality in SMT operations where the PCB is taken off-line (post-print) for manual dispensing.


Practical Components - Booth 2719

Practical Components, a distributor of mechanical IC samples or "dummy" components and SMD production tools and equipment, will showcase its latest technology.

Practical Components' products are designed to help engineers qualify their technology, and train and grow their business while resulting in significant cost savings. According to Practical President Kevin Laphen, "Practicals' dummy products are selected with care to be the finest ‘factory quality' components as well as boards and kits that simulate real world production. Special attention is given to lead-free availability and formulations including all the various SAC formulations."

On display will be new state-of-the-art Amkor Technology PoP (PSvfBGA) packages and body sizes, a stackable very thin fine-pitch BGA package; Amkor tsMLF (Thin Substrate Micro LeadFrame-TAPP) and the award winning Practical Components/Aegis Industrial Software PC009-40 Traceability and Control Validation Kit

Supporting these products is Practical's free catalog and design guide that is organized by package type/category with each product accompanied by drawings, description, part number with special attention to lead-free availability and formulations as well as the new CD ROM containing bonus material, CircuitCAM tryout, and gerber and CircuitCAM project files.


PROMATION - Booth 2271

PROMATION will introduce its latest PCB handling solutions.

PROMATION's transfer and work station conveying solutions are packed with features such as independent variable speed (per drive), front ESD work surfaces with ground strap, Check and Pass mode selection, foot pedal and hand button for release feature (in Check mode), and more.

Loading, UnLoading, Turn and Flip units are now equipped with thin film touch panels, Auto and Manual operation modes, three-color light towers, and many other features.

Rigid designs and exceptional pricing are hallmarks for PROMATION's latest lineup.



R&D Technical Services - Booth 2203

Vapor Works, a division of R&D Technical Services Inc., announces that it will introduce V-Works Vapor Phase Rework Station at APEX.

The Vapor Works division was formed to service the single component rework sector of the electronics industry. Forty years of combined vapor phase experience went into the development of V-Works 24, the industry's first Vapor Phase Rework Station.

V-Works 24 is designed specifically as a single component rework tool using vapor phase technology to transfer heat for removal and replacement of single components and connectors on circuit boards. The tool uses proven vapor phase technology to deliver uniform condensation heat transfer to the single component rework environment. The V-Works 24 allows users to utilize the absolute limits of maximum temperatures, small delta at peak temperatures, and the unsurpassed uniformity and heat transfer ability that vapor phase is famous for to remove and replace single components.

The V-Works 24 solves many of the problems now plaguing the rework sector of the electronics industry and, specifically, lead-free applications. Hot air and IR rework stations may bring issues such as overheating, shadowing, deflection and reflection to rework. These become non-issues with the new V-Works 24 Vapor Rework Station.

The rework station comes standard with numerous features including a 24 x 24" working envelope, split mirror and camera vision system for aligning components, on-board recipe storage for precise rework parameters, touch screen operator interface for ease of use, manual x, y and z adjustment, vacuum system for containment of working fluids and vapors, bottom-side global preheat, semi-automatic cycle for removal and replacement of components, cool down function, high-quality construction, and full safety features.


RMD Instruments - Booth 1563

RMD Instruments LLC announces that it will premier a new solder analysis and identification features of its innovative LeadTracer-RoHS XRF system.

The system is a major innovation and advancement of the XRF analysis technology, and is the only XRF system designed specifically for the electronics industry to provide fast, accurate and portable screening capability to meet RoHS directives.

RMD has added a new solder analysis and identification feature to its LeadTracer-RoHS XRF system that accurately identifies all solder alloys within minutes. This is helpful when completing rework or repair for finished assemblies. Additionally, this new resource accurately performs a "solder pot" analysis, allowing users to track "changes" in their process. This is especially beneficial for SAC alloys in which an increase in Cu and Pb content (due to component drag-out) can affect not only the soldering process, but also RoHS compliance status.

The LeadTracer-RoHS XRF system has a unique approach because it analyses the entire body of the components in a short period of time, rather than simply carrying out a surface analysis. This speeds up the RoHS screening requirements and improves the overall throughput of the quality control process. The LeadTracer-RoHS' ability to analyze the entire energy spectrum eliminates the possibility of false-negative indications in components that otherwise would have found their way into the manufacturing process.

The LeadTracer-RoHS XRF system is now available with a sample preparation stand developed with the needs of the end user in mind.


Seica - Booth 205

High fault coverage, speed, ease of use, flexibility, cost effectiveness: these are just some of the demands which are part of today's leading electronics test systems. It's a tall order, but Seica's test experience continues to lead the industry along the "Road to Innovation" with its modular and expandable platform strategy. This strategy goes beyond expectations and meets more needs than imagined.

The first showcased test system is the AERIAL M4 Flying Probe. With its innovative, vertical, and compact architecture, this system introduces a new dimension in fixtureless test; both from the viewpoint of minimizing floor space requirements but also due to the extremely fast and stable double-side probing. Existing double-side flying probe systems today experience speed performance issues due to the natural oscillation of a horizontally mounted UUT; because of Aerial's unique architecture this oscillation is virtually eliminated.

Another highlight in this year's booth is aimed at manufacturers interested in functional test. Seica has developed a series of turn-key solutions based on the Strategy line of test systems. The solution on display, the Strategy.DT, specifically addresses the test requirements for products in the consumer and automotive markets.


Sono-Tek - Booth 263

Sono-Tek Corporation will introduce EZ-Flux Ultrasonic Reciprocating Spray Fluxing System. EZ-Flux is an economical ultrasonic spray fluxing system designed on a reciprocating platform. The ultrasonic atomization module in EZ-Flux uses a high-impact flux transfer system for maximizing topside fill.

The system is easily integrated into all major wave solder machines and is compatible with all PCB fluxes, including fluxes that contain rosin (often used in lead-free manufacturing).

CEO Christopher L. Coccio, PhD, said, "The EZ-Flux is the first economically priced reciprocating ultrasonic spray fluxer on the market. This machine will allow small to mid-size PCB manufacturers to get the same high-quality fluxing results achieved with ultrasonic spray that has historically only been affordable to larger manufacturers."

With thousands of spray fluxing systems installed throughout the world, Sono-Tek has gained a reputation of innovation in PCB fluxing. Our full line of spray fluxing systems provides cutting edge technology that meets and exceeds the changing demands of the industry.


VJ Electronix - Booth 648

VJ Electronix will introduce its new platform designed to perform a variety of specific tasks for rework and production.

The new platform may be configured with single or multiple application-specific capabilities, allowing users to define systems to meet their individual needs. Systems may be optimized for component removal, site preparation, or assembly and reflow.

"We have taken a new approach to meeting high-volume rework demands," said Regional Sales Manger Al Cabral. "With the modular design, systems can be field upgraded when our customers need change."

Designed-in flexibility allows systems to be grouped so that each has its own function. Additionally, a variety of tooling and vision options will be offered. Standard and high-resolution models are available that allow selection of the right product for the right job.

This new innovation paired with the recently released Vertex-A X-Ray system will streamline the way reworking boards is accomplished by providing a more economical operation.