IPC to host international conference on flexible circuits

As new applications for flex circuitry are revealed, companies are capitalizing on its growing benefits - from greater impedance control to packaging solutions. To provide the industry with a broad spectrum of information on the potential of flexible circuitry and the latest industry developments for this interconnection technique, IPC has developed the IPC International Conference on Flexible Circuits, February 12-14, 2008, in Phoenix, Ariz.

Educational courses will take place February 12 and 14 and will cover topics such as materials, structures and processes of printed circuits; flex circuitry applications; troubleshooting for printed board manufacturing; and desmear metallization and plating of flex and rigid flex printed boards.

Nearly a dozen topics will be presented during the technical conference on February 13. Attendees can learn about the history of flex circuitry; catalytic ink printing; evolving materials, manufacturing technologies and applications for flex circuits; top 10 mistakes in rigid-flex designs; and more.

"In today's marketplace, flex offers designers and engineers a wide array of choices with a growing number of benefits. Flex is often the way to go for managing high temperatures, reducing weight and space and saving on assembly costs," says Jean Hebeisen, IPC director of professional development. Anyone interested in learning more about the fundamentals and emerging applications of flexible circuits should attend the conference.

For additional information, including complete course/conference descriptions and registration details, visit www.ipc.org/flex