Palomar presents two papers at IMAPS
Nov 01, 2007
Palomar Technologies, provider of precision automation equipment, process development, and assembly services for microelectronic assembly, will present High Brightness Matrix LED Assembly Challenges and Solutions by Daniel D. Evans, Jr., Palomar's senior scientist.
Philip Couts, TDK Corporation of America, will present Gold Stud Bumping for High Density Flip Chip Interconnect, co-authored by Mr. Evans. The IMAPS symposium will be held November 11 to 15, 2007 in San Jose, California.
The presentation High Brightness Matrix LED Assembly Challenges and Solutions details research that shows how pulsed heat eutectic die attach and wire chain bonding used in matrix LED assembly are used to maximize the power and light [lumens] from high power LED matrices.
The paper Gold Stud Bumping for High Density Flip Chip Interconnect details a robust flip chip solution using the Gold to Gold Interconnect (GGI) process for device packaging companies.