FINTECH to exhibit high accuracy die bonder at IMAPS 2007
Nov 02, 2007
FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 727 at the upcoming IMAPS 2007 exhibition, scheduled to take place November 13 to 15, 2007, at the San Jose Convention Center in San Jose, Calif.
The motorized configuration of the FINEPLACER® Lambda, which will be exhibited during IMAPS, provides auto-touchdown and die placement, as well as controlled bonding operation after manual alignment of die and substrate. Advantages of this system include hands-off die placement; process reproducibility, placement of die with dimensions that exceed the optical field of view; up to 10 programmable microscope positions; and upgradeable with integrated microscope.
Applications for the FINEPLACER® Lambda include eutectic soldering, Au/Sn soldering, thermo compression, thermo-/ultrasonic bonding, adhesive technologies, and MEMS/MOEMS placement.