Universal Instruments' joint seminar well-received in Shanghai
Nov 05, 2007
Universal Instruments, together with six leading companies in electronics equipments and materials supply, recently held a seminar in Shanghai with a turnout of over 100 participants from leading manufacturers.
The other six participating companies were DEK, Vitronics Soltec, OK International, KIC, Asymtek and Henkel Electronics, covering the entire electronic manufacturing process.
As handling small components and lead-free technology were still the major concerns in the industry, the seminar in particular introduced the latest technology on package-on-package and flip chip assembly.
Experts from these seven leading companies shared their knowledge on product applications with illustrative case studies. Topics included flip chip assembly using surface mounting equipment, 01005 resistance's reflow and assembly, stencil technology, dispensing processes for underfilling of PoP, lead-free solder application for SMT, lead-free solder joints reliability and process control, lead-free PoP rework, process control with lead-free hand soldering, and reflow soldering process optimization.
The seminar offered a thorough discussion touching different steps in the entire SMT assembly. Participants raised many questions following each presentation with in-depth exchange between speakers and audience.
On top of the one-day seminar, participants were shown a hands-on demonstration utilizing the equipments from participating companies in the Advanced Process Laboratory of Universal Instruments in Shanghai.